American Elements: Gold-Copper Sputtering Target Supplier & Tech Info

See research below. American Elements specializes in producing high purity Gold-Copper sputtering targets with the highest possible density High Purity (99.99%) Metallic Sputtering Target

High Purity (99.99%) Metallic Sputtering Target

and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. We also produce Gold as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.

Gold is a Block D, Group 11, Period 6 element. The electronic configuration is [Xe] 4f¹⁴² 5d¹⁰ 6s¹. In its elemental form gold's CAS number is 7440-57-5. The gold atom has a radius of 144.2.pm and it's Van der Waals radius is 166.pm. Gold is a soft metal and is usually alloyed to give it more strength. It is a good conductor of heat and electricity, and is unaffected by air and most reagents. It is used in coinage and is a standard for monetary systems. It is also extensively used for jewelry, dental work, and for plating. It is used for coating certain space satellites, as it is a good reflector of infrared and is inert. One area that has seen significant growth is the use of gold in electronics, particularly within telecommunications, information technology and safety critical applications. Similarly, within computers there are usually gold-plated edge connectors. Gold bonding wires are used extensively within semiconductor packages, gold thick film inks are applied in the fabrication of hybrid circuits and gold's excellent solder wetting properties are used to form a very thin protective layer on copper laminate printed circuit boards.

Copper is a Block D, Group 11, Period 4 element. The electronic configuration is [Ar] 3d¹⁰ 4s¹. In its elemental form copper's CAS number is 7440-50-8. The copper atom has a radius of 127.8 .pm and it's Van der Waals radius is 140.pm. Due to its high electrical conductivity, large amounts of copper are used by the electrical industry for wire. Of all pure metals, only silver has a higher electrical conductivity. Copper is also resistant to corrosion caused by moisture, making it a widely used material in pipes, coins, and jewelry. Copper is often too soft for its applications, so it is incorporated in numerous alloys. For example, brass is a copper-zinc alloy, and bronze is a copper-tin alloy. Copper sulfate (CuSO 4·H2O), also known as blue vitrol, is the most well-known copper compound. It is used as an agricultural poison, an algicide, and as a pigment for inks. Cuprous chloride (CuCl) is a powder used to absorb carbon dioxide (CO2). Copper cyanide (CuCN) is often used in electroplating applications. Copper is available as metal and compounds with purities from 99% to 99.9999% (ACS grade to ultra-high purity); metals in the form of foil, sputtering target, and rod, and compounds as submicron and nanopowder.