Copper-63 Metal Isotope

63Cu34


Product Product Code Order or Specifications
Copper-63 Metal CU-M-63-ISO Contact American Elements

PROPERTIES Formula N ENSDF Citation Half Life Jp Sn (keV) Sp (keV) Abundance
63Cu 29 NDS 64,815 (1991) stable 3/2- 10853  4 6122.44  7 69.17  3%


Copper 63 Metal (Copper-63) is a stable (non-radioactive) isotope of Copper. See above table for ENSDF Citation and Half Life. It is both naturally occurring and a produced by fission. Copper 63 Metal is one of over 250 stable Metallic isotopes produced by American Elements for biological and biomedical labeling, as target materials and other applications. Copper Metal 63 additionally has special application in noninvasive studies of copper metabolism and requirements, Studies of congenital disorders and body kinetics in gastrointestinal diseases, and investigation of role in maintaining integrity of tissue such as myocardium. Copper Metal is also available in ultra high purity and as nanoparticles. For thin film applications it is available as rod, pellets, pieces, granules and sputtering targets and as either an ingot or powder. Copper Metal 63 isotopic material is generally immediately available. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Additional technical, research and safety (MSDS) information is available as is a Reference Calculator for converting relevant units of measurement.

Copper Bohr ModelCopper (Cu) atomic and molecular weight, atomic number and elemental symbolCopper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC.In its elemental form, copper has a red-orange metallic luster appearance. Elemental Copper Of all pure metals, only silver has a higher electrical conductivity.The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus." Cyprus, a Mediterranean island, was known as an ancient source of mined copper. For more information on copper, including properties, safety data, research, and American Elements' catalog of copper products, visit the Copper Information Center.


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PACKAGING SPECIFICATIONS FOR BULK & RESEARCH QUANTITIES
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Material Safety Data Sheet (MSDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes.


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Recent Research & Development for Copper

  • Ke Liu, Yang Song, Shaowei Chen, Electrocatalytic activities of alkyne-functionalized copper nanoparticles in oxygen reduction in alkaline media, Journal of Power Sources, Volume 268, 5 December 2014
  • E. Linga Reddy, J. Karuppiah, Hyun Chan Lee, Dong Hyun Kim, Steam reforming of methanol over copper loaded anodized aluminum oxide (AAO) prepared through electrodeposition, Journal of Power Sources, Volume 268, 5 December 2014
  • Lijie Zhang, Ming Meng, Xiaojing Wang, Shuang Zhou, Lijuan Yang, Tianyong Zhang, Lirong Zheng, Jing Zhang, Tiandou Hu, A series of copper-free ternary oxide catalysts ZnAlCex used for hydrogen production via dimethyl ether steam reforming, Journal of Power Sources, Volume 268, 5 December 2014
  • Laura Sanz, David Lloyd, Eva Magdalena, Jesús Palma, Kyösti Kontturi, Description and performance of a novel aqueous all-copper redox flow battery, Journal of Power Sources, Volume 268, 5 December 2014
  • Kaiyou Zhang, Hong Chen, Xue Wang, Donglin Guo, Chenguo Hu, Shuxia Wang, Junliang Sun, Qiang Leng, Synthesis and structure determination of potassium copper selenide nanowires and solid-state supercapacitor application, Journal of Power Sources, Volume 268, 5 December 2014
  • Tamer Crosby, Giacomo Po, Nasr M. Ghoniem, Modeling plastic deformation of post-irradiated copper micro-pillars, Journal of Nuclear Materials, Volume 455, Issues 1–3, December 2014
  • Gang He, Kunyuan Xu, Shibin Guo, Xueqiang Qian, Zengchao Yang, Guanghua Liu, Jiangtao Li, Preparation of tungsten fiber reinforced-tungsten/copper composite for plasma facing component, Journal of Nuclear Materials, Volume 455, Issues 1–3, December 2014
  • M.M. El-Nahass, F.S.H. Abu-Samaha, Shokry Menshawy, Eman Elesh, Effect of annealing on structural and optical properties of copper tetraphenylporphyrin (CuTPP) thin films, Optics & Laser Technology, Volume 64, December 2014
  • Krzysztof Naplocha, Kazimierz Granat, Jacek Kaczmar, Reactive melt infiltration of copper in Al–Cr preforms produced through combustion synthesis, Journal of Alloys and Compounds, Volume 613, 15 November 2014
  • Pouyan Paknahad, Masoud Askari, Milad Ghorbanzadeh, Application of sol–gel technique to synthesis of copper–cobalt spinel on the ferritic stainless steel used for solid oxide fuel cell interconnects, Journal of Power Sources, Volume 266, 15 November 2014
  • Xin Qing, Jingjing Shi, Chengyu Ma, Mengyang Fan, Zhengyu Bai, Zhongwei Chen, Jinli Qiao, Jiujun Zhang, Simultaneous formation of nitrogen and sulfur-doped transition metal catalysts for oxygen reduction reaction through pyrolyzing carbon-supported copper phthalocyanine tetrasulfonic acid tetrasodium salt, Journal of Power Sources, Volume 266, 15 November 2014
  • Ferhat Aslan, Ahmet Tumbul, Non-vacuum processed Cu2ZnSnS4 thin films: Influence of copper precursor on structural, optical and morphological properties, Journal of Alloys and Compounds, Volume 612, 5 November 2014
  • Y.S.M. Alajerami, S. Hashim, S.K. Ghoshal, D.A. Bradley, M. Mhareb, M.A. Saleh, Copper doped borate dosimeters revisited, Journal of Luminescence, Volume 155, November 2014
  • Sung-Hyeon Park, Wan-Ho Chung, Hak-Sung Kim, Temperature changes of copper nanoparticle ink during flash light sintering, Journal of Materials Processing Technology, Volume 214, Issue 11, November 2014
  • J.J. Chen, A.L. Ahmad, B.S. Ooi, Thermo-responsive properties of poly(N-isopropylacrylamide-co-acrylic acid) hydrogel and its effect on copper ion removal and fouling of polymer-enhanced ultrafiltration, Journal of Membrane Science, Volume 469, 1 November 2014
  • Zuwei Yin, Fuyi Chen, A facile electrochemical fabrication of hierarchically structured nickel–copper composite electrodes on nickel foam for hydrogen evolution reaction, Journal of Power Sources, Volume 265, 1 November 2014
  • W.H. Zhou, H. Guo, Z.J. Xie, C.J. Shang, R.D.K. Misra, Copper precipitation and its impact on mechanical properties in a low carbon microalloyed steel processed by a three-step heat treatment, Materials & Design, Volume 63, November 2014
  • Xiaofan Du, Tong Gao, Yuying Wu, Xiangfa Liu, Effects of copper addition on the in-situ synthesis of SiC particles in Al–Si–C–Cu system, Materials & Design, Volume 63, November 2014
  • C. Dang, Q.L. Che, B.L. Gao, L. Li, B.B. Wang, Growth, photoluminescence and thermal conductance of graphene-like nanoflakes grown on copper foils in methane environment, Materials Science in Semiconductor Processing, Volume 27, November 2014
  • M. Somasundaram, R. Saravanathamizhan, C. Ahmed Basha, V. Nandakumar, S. Nathira Begum, T. Kannadasan, Recovery of copper from scrap printed circuit board: modelling and optimization using response surface methodology, Powder Technology, Volume 266, November 2014