American Elements Logo and U.S. Registered Trademark
Copper Rod
High Purity Cu Rod
7440-50-8
Product
Product Code
Order or Specifications
99% Copper Rod
CU-M-02-R
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99.9% Copper Rod
CU-M-03-R
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99.99% Copper Rod
CU-M-04-R
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99.999% Copper Rod
CU-M-05-R
Contact American Elements
American Elements specializes in producing high purity uniform shaped Copper Rod with the highest possible density 99.9+% Ultra High Purity Metallic Rods and smallest possible average grain sizes for use in semiconductor, Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Our standard Rod sizes range from 1/8" x 1/8" to 1/4" x 1/4" and 3 mm diameter. We can also provide Rod outside this range and deposition materials for specific applications such as fuel cells and solar energy and for thin film deposition on glass or metal substrates. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes nanoparticles. We have a variety of standard sized rod molds.. See research below. We also produce Copper as powder, ingot, pieces, pellets, disc, granules, wire, and in compound forms, such as oxide. Other shapes are available by request.

Copper is a Block D, Group 11, Period 4 element. The electronic configuration is [Ar] 3d10 4s1. In its elemental form copper's CAS number is 7440-50-8. The copper atom has a radius of 127.8 .pm and it's Van der Waals radius is 140.pm. Due to its high electrical conductivity, large amounts of copper are used by the electrical industry for wire. Of all pure metals, only silver has a higher electrical conductivity. Copper is also resistant to corrosion caused by moisture, making it a widely used material in pipes, coins, and jewelry.

Formula CAS No. Appearance Molecular Weight
Cu 7440-50-8 Reddish Metal 63.55
PRODUCT CATALOG Submicron & Nanopowder Tolling Ultra High Purity Sputtering Target Crystal Growth Rod, Plate, Powder, etc.

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Recent Research & Development for Copper

  • Removal of copper, lead, and zinc from contaminated water by saltbush biomass: Analysis of the optimum binding, stripping, and binding mechanism. Bioresour Technol. 2008 Jul;99(10):4438-44. Epub 2007 Oct 10.

  • Preferring cellulose of Eichhornia crassipes to prepare xanthogenate to other plant materials and its adsorption properties on copper. Bioresour Technol. 2008 Jul;99(10):4460-6. Epub 2007 Oct 24.

  • Physiological role of the cellular prion protein. Vet Res. 2008 Jul-Aug;39(4):9. Epub 2007 Nov 27.

  • Removal of copper ions by the filamentous fungus, Rhizopus oryzae from aqueous solution. Bioresour Technol. 2008 Jun;99(9):3829-35. Epub 2007 Sep 4.

  • Towards new copper based radiopharmaceuticals. Q J Nucl Med Mol Imaging. 2008 Jun;52(2):174-84.

  • Production and separation of ''non-standard'' PET nuclides at a large cyclotron facility: the experiences at the Paul Scherrer Institute in Switzerland. Q J Nucl Med Mol Imaging. 2008 Jun;52(2):145-50. Epub 2008 Jan 5.

  • Sarar technology for the application of Copper-64 in biology and materials science. Q J Nucl Med Mol Imaging. 2008 Jun;52(2):193-202. Epub 2008 Jan 5.

  • Cross-bridged macrocyclic chelators for stable complexation of copper radionuclides for PET imaging. Q J Nucl Med Mol Imaging. 2008 Jun;52(2):185-92. Epub 2007 Nov 28.

  • Dissolution of copper, tin, and iron from sintered tungsten-bronze spheres in a simulated avian gizzard, and an assessment of their potential toxicity to birds. Sci Total Environ. 2008 May 15;394(2-3):283-9. Epub 2008 Mar 3.

  • Soil quality and barley growth as influenced by the land application of two compost types. Bioresour Technol. 2008 May;99(8):2913-8. Epub 2007 Aug 15.

  • Zinc and copper uptake by silver beet grown in secondary treated effluent. Bioresour Technol. 2008 May;99(7):2537-43. Epub 2007 Jun 13.

  • Comparison of different types of biomasses for copper biosorption. Bioresour Technol. 2008 May;99(7):2559-65. Epub 2007 Jun 13.

  • Adsorption behavior of copper ions on Mucor rouxii biomass through microscopic and FTIR analysis. Colloids Surf B Biointerfaces. 2008 May 1;63(1):138-45. Epub 2007 Dec 15.

  • Potato peels as solid waste for the removal of heavy metal copper(II) from waste water/industrial effluent. Colloids Surf B Biointerfaces. 2008 May 1;63(1):116-21. Epub 2007 Nov 28.

  • Possible carcinogenic risks of copper gluconate and their prevention by co-administered green tea catechins evaluated by a rat medium-term multi-organ carcinogenicity bioassay protocol. Food Chem Toxicol. 2008 May;46(5):1760-70. Epub 2008 Jan 21.

  • Removal of copper ions from aqueous solutions by kaolinite and batch design. J Hazard Mater. 2008 May 1;153(1-2):867-76. Epub 2007 Sep 16.

  • Removal of copper ions from aqueous solutions by hazelnut shell. J Hazard Mater. 2008 May 1;153(1-2):677-84. Epub 2007 Sep 6.

  • Filtration by a novel nanofiber membrane and alumina adsorption to remove copper(II) from groundwater. J Hazard Mater. 2008 May 1;153(1-2):860-6. Epub 2007 Sep 14.

  • Performance of supported catalysts based on a new copper vanadate-type precursor for catalytic oxidation of toluene. J Hazard Mater. 2008 May 1;153(1-2):628-34. Epub 2007 Sep 6.

  • Trace element exposure in the environment from MSW landfill leachate sediments measured by a sequential extraction technique. J Hazard Mater. 2008 May 1;153(1-2):751-8. Epub 2007 Sep 8.

 

 

 

 

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