Gold Silver Copper Alloy

Au Ag Cu Alloy


Product Product Code Order or Specifications
Au- 60% Ag-20% Cu-20% AUAG-CU-01-P.20CU Contact American Elements

Gold Silver Copper is one of numerous metal alloys sold by American Elements under the tradename AE Alloys™. Generally immediately available in most volumes, AE Alloys™ are available as bar, Ingot, ribbon, wire, shot, sheet, and foil. Ultra high purity and high purity forms also include metal powder, submicron powder and nanoscale, targets for thin film deposition, and pellets for chemical vapor deposition (CVD) and physical vapor deposition (PVD) applications. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Primary applications include bearing assembly, ballast, casting, step soldering, and radiation shielding.

Gold (Au) atomic and molecular weight, atomic number and elemental symbol Gold (atomic symbol: Au, atomic number: 79) is a Block D, Group 11, Period 6 element with an atomic weight of 196.966569. The number of electrons in each of Gold's shells is 2, 8, 18, 32, 18, 1 and its electron configuration is [Xe] 4f142 5d10 6s1. Gold Bohr ModelThe gold atom has a radius of 144 pm and a Van der Waals radius of 217 pm. Gold was first discovered by Early Man prior to 6000 B.C. In its elemental form, gold has a metallic yellow appearance. Elemental Gold Gold is a soft metal and is usually alloyed to give it more strength. It is a good conductor of heat and electricity, and is unaffected by air and most reagents. It is one of the least reactive chemical elements. Gold is often found as a free element and with silver as a gold silver alloy. Less commonly, it is found in minerals as gold compounds, usually with tellurium. For more information on gold, including properties, safety data, research, and American Elements' catalog of gold products, visit the Gold Information Center.

Silver (Ag)atomic and molecular weight, atomic number and elemental symbolSilver (atomic symbol: Ag, atomic number: 47) is a Block D, Group 11, Period 5 element with an atomic weight of 107.8682. Silver Bohr ModelThe number of electrons in each of Silver's shells is 2, 8, 18, 18, 1 and its electron configuration is [Kr]4d10 5s1. The silver atom has a radius of 144 pm and a Van der Waals radius of 203 pm. Silver was first discovered by Early Man prior to 5000 BC. In its elemental form, silver has a brilliant white metallic luster. Elemental SilverIt is a little harder than gold and is very ductile and malleable, being exceeded only by gold and perhaps palladium. Pure silver has the highest electrical and thermal conductivity of all metals and possesses the lowest contact resistance. It is stable in pure air and water, but tarnishes when exposed to ozone, hydrogen sulfide, or air containing sulfur. It is found in copper, copper-nickel, lead, and lead-zinc ores among others. Silver was named after the Anglo-Saxon word "seolfor" or "siolfur," meaning 'silver'. For more information on silver, including properties, safety data, research, and American Elements' catalog of silver products, visit the Silver Information Center.

Copper Bohr ModelCopper (Cu) atomic and molecular weight, atomic number and elemental symbolCopper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC.In its elemental form, copper has a red-orange metallic luster appearance. Elemental Copper Of all pure metals, only silver has a higher electrical conductivity.The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus." Cyprus, a Mediterranean island, was known as an ancient source of mined copper. For more information on copper, including properties, safety data, research, and American Elements' catalog of copper products, visit the Copper Information Center.


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PACKAGING SPECIFICATIONS FOR BULK & RESEARCH QUANTITIES
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Material Safety Data Sheet (MSDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes.


Have a Question? Ask a Chemical Engineer or Material Scientist
Request an MSDS or Certificate of Analysis





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Production Catalog Available in 36 Countries & Languages


Recent Research & Development for Gold

  • Tamara V. Basova, Roman G. Parkhomenko, Igor K. Igumenov, Aseel Hassan, Mahmut Durmuş, Ayşe Gül Gürek, Vefa Ahsen, Composites of liquid crystalline nickel phthalocyanine with gold nanoparticles: Liquid crystalline behaviour and optical properties, Dyes and Pigments, Volume 111, December 2014
  • Xianyi Cao, Fei Shen, Minwei Zhang, Jiajia Guo, Yeli Luo, Jingyue Xu, Ying Li, Chunyan Sun, Highly sensitive detection of melamine based on fluorescence resonance energy transfer between rhodamine B and gold nanoparticles, Dyes and Pigments, Volume 111, December 2014
  • Guowen An, Shuguang Li, Wan Zhang, Zhenkai Fan, Yajie Bao, A polarization filter of gold-filled photonic crystal fiber with regular triangular and rectangular lattices, Optics Communications, Volume 331, 15 November 2014
  • Shweta Verma, B. Tirumala Rao, A.K. Srivastava, H.S. Patel, S. Satapathy, M.P. Joshi, V.K. Sahu, L.M. Kukreja, Studies on interdependent optical properties of Rhodamine 6G dye and gold nanoparticles at different dilutions of aqueous solutions, Journal of Luminescence, Volume 155, November 2014
  • J. Burunkova, I. Csarnovics, I. Denisyuk, L. Daróczi, S. Kökényesi, Enhancement of laser recording in gold/amorphous chalcogenide and gold/acrylate nanocomposite layers, Journal of Non-Crystalline Solids, Volume 402, 15 October 2014
  • Weihua Hu, Hongming Chen, Huanhuan Zhang, Guangli He, Xin Li, Xiaoxing Zhang, Yang Liu, Chang Ming Li, Sensitive detection of multiple mycotoxins by SPRi with gold nanoparticles as signal amplification tags, Journal of Colloid and Interface Science, Volume 431, 1 October 2014
  • Sonia Gil, Carmen Jiménez-Borja, J. Martin-Campo, Amaya Romero, José Luis Valverde, Luz Sánchez-Silva, Stabilizer effects on the synthesis of gold-containing microparticles. Application to the liquid phase oxidation of glycerol, Journal of Colloid and Interface Science, Volume 431, 1 October 2014
  • Yong Ping Dong, Ting Ting Gao, Xiang Feng Chu, Jun Chen, Cheng Ming Wang, Flow injection-chemiluminescence determination of ascorbic acid based on luminol–ferricyanide–gold nanoparticles system, Journal of Luminescence, Volume 154, October 2014
  • X.M. Yang, Z.W. Zhong, E.M. Diallo, Z.H. Wang, W.S. Yue, Silicon wafer wettability and aging behaviors: Impact on gold thin-film morphology, Materials Science in Semiconductor Processing, Volume 26, October 2014
  • Anand Singh, A.K. Shukla, Sumit Jain, Brijesh S. Yadav, R. Pal, Electrical characteristics of electroless gold contacts on p-type Hg1−xCdxTe, Materials Science in Semiconductor Processing, Volume 26, October 2014

Recent Research & Development for Silver

  • Liangtao Pu, Kexun Li, Zhihao Chen, Peng Zhang, Xi Zhang, Zhou Fu, Silver electrodeposition on the activated carbon air cathode for performance improvement in microbial fuel cells, Journal of Power Sources, Volume 268, 5 December 2014
  • Yanan Yu, Mingzhe Jia, Huifeng Tian, Jingbo Hu, The fabrication of silver ion implantation-modified electrode and its application in electrocatalytic oxidation of formaldehyde, Journal of Power Sources, Volume 267, 1 December 2014
  • Yuan-Fong Chau, Chih-Chan Hu, Ci-Yao Jheng, Yao-Tsung Tsai, Li-Zen Hsieh, Wayne Yang, Chien-Ying Chiang, Yuh-Sien Sun, Cheng-Min Lee, Numerical investigation of surface plasmon resonance effects on photocatalytic activities using silver nanobeads photodeposited onto a titanium dioxide layer, Optics Communications, Volume 331, 15 November 2014
  • Safaa N. Saud, E. Hamzah, T. Abubakar, H.R. Bakhsheshi-Rad, S. Farahany, A. Abdolahi, M.M. Taheri, Influence of Silver nanoparticles addition on the phase transformation, mechanical properties and corrosion behaviour of Cu–Al–Ni shape memory alloys, Journal of Alloys and Compounds, Volume 612, 5 November 2014
  • Osman Ozturk, Ozlem Oter, Serdar Yildirim, Elif Subasi, Kadriye Ertekin, Erdal Celik, Hamdi Temel, Tuning oxygen sensitivity of ruthenium complex exploiting silver nanoparticles, Journal of Luminescence, Volume 155, November 2014
  • Leila Farzampour, Mohammad Amjadi, Sensitive turn-on fluorescence assay of methimazole based on the fluorescence resonance energy transfer between acridine orange and silver nanoparticles, Journal of Luminescence, Volume 155, November 2014
  • Dennis Wittmaier, Norbert Wagner, K. Andreas Friedrich, Hatem M.A. Amin, Helmut Baltruschat, Modified carbon-free silver electrodes for the use as cathodes in lithium–air batteries with an aqueous alkaline electrolyte, Journal of Power Sources, Volume 265, 1 November 2014
  • Yawei Qi, Yaxun Zhou, Libo Wu, Fengjing Yang, Shengxi Peng, Shichao Zheng, Dandan Yin, Enhanced upconversion emissions in Ho3 +/Yb3 + codoped tellurite glasses containing silver NPs, Journal of Non-Crystalline Solids, Volume 402, 15 October 2014
  • Klára Magyari, Razvan Stefan, Dan Cristian Vodnar, Adriana Vulpoi, Lucian Baia, The silver influence on the structure and antibacterial properties of the bioactive 10B2O3− 30Na2O−60P2O2 glass, Journal of Non-Crystalline Solids, Volume 402, 15 October 2014
  • G. Venkateswara Rao, H.D. Shashikala, Optical, dielectric and mechanical properties of silver nanoparticle embedded calcium phosphate glass, Journal of Non-Crystalline Solids, Volume 402, 15 October 2014

Recent Research & Development for Copper

  • Ke Liu, Yang Song, Shaowei Chen, Electrocatalytic activities of alkyne-functionalized copper nanoparticles in oxygen reduction in alkaline media, Journal of Power Sources, Volume 268, 5 December 2014
  • E. Linga Reddy, J. Karuppiah, Hyun Chan Lee, Dong Hyun Kim, Steam reforming of methanol over copper loaded anodized aluminum oxide (AAO) prepared through electrodeposition, Journal of Power Sources, Volume 268, 5 December 2014
  • Lijie Zhang, Ming Meng, Xiaojing Wang, Shuang Zhou, Lijuan Yang, Tianyong Zhang, Lirong Zheng, Jing Zhang, Tiandou Hu, A series of copper-free ternary oxide catalysts ZnAlCex used for hydrogen production via dimethyl ether steam reforming, Journal of Power Sources, Volume 268, 5 December 2014
  • Laura Sanz, David Lloyd, Eva Magdalena, Jesús Palma, Kyösti Kontturi, Description and performance of a novel aqueous all-copper redox flow battery, Journal of Power Sources, Volume 268, 5 December 2014
  • Kaiyou Zhang, Hong Chen, Xue Wang, Donglin Guo, Chenguo Hu, Shuxia Wang, Junliang Sun, Qiang Leng, Synthesis and structure determination of potassium copper selenide nanowires and solid-state supercapacitor application, Journal of Power Sources, Volume 268, 5 December 2014
  • Tamer Crosby, Giacomo Po, Nasr M. Ghoniem, Modeling plastic deformation of post-irradiated copper micro-pillars, Journal of Nuclear Materials, Volume 455, Issues 1–3, December 2014
  • Gang He, Kunyuan Xu, Shibin Guo, Xueqiang Qian, Zengchao Yang, Guanghua Liu, Jiangtao Li, Preparation of tungsten fiber reinforced-tungsten/copper composite for plasma facing component, Journal of Nuclear Materials, Volume 455, Issues 1–3, December 2014
  • M.M. El-Nahass, F.S.H. Abu-Samaha, Shokry Menshawy, Eman Elesh, Effect of annealing on structural and optical properties of copper tetraphenylporphyrin (CuTPP) thin films, Optics & Laser Technology, Volume 64, December 2014
  • Krzysztof Naplocha, Kazimierz Granat, Jacek Kaczmar, Reactive melt infiltration of copper in Al–Cr preforms produced through combustion synthesis, Journal of Alloys and Compounds, Volume 613, 15 November 2014
  • Pouyan Paknahad, Masoud Askari, Milad Ghorbanzadeh, Application of sol–gel technique to synthesis of copper–cobalt spinel on the ferritic stainless steel used for solid oxide fuel cell interconnects, Journal of Power Sources, Volume 266, 15 November 2014
  • Xin Qing, Jingjing Shi, Chengyu Ma, Mengyang Fan, Zhengyu Bai, Zhongwei Chen, Jinli Qiao, Jiujun Zhang, Simultaneous formation of nitrogen and sulfur-doped transition metal catalysts for oxygen reduction reaction through pyrolyzing carbon-supported copper phthalocyanine tetrasulfonic acid tetrasodium salt, Journal of Power Sources, Volume 266, 15 November 2014
  • Ferhat Aslan, Ahmet Tumbul, Non-vacuum processed Cu2ZnSnS4 thin films: Influence of copper precursor on structural, optical and morphological properties, Journal of Alloys and Compounds, Volume 612, 5 November 2014
  • Y.S.M. Alajerami, S. Hashim, S.K. Ghoshal, D.A. Bradley, M. Mhareb, M.A. Saleh, Copper doped borate dosimeters revisited, Journal of Luminescence, Volume 155, November 2014
  • Sung-Hyeon Park, Wan-Ho Chung, Hak-Sung Kim, Temperature changes of copper nanoparticle ink during flash light sintering, Journal of Materials Processing Technology, Volume 214, Issue 11, November 2014
  • J.J. Chen, A.L. Ahmad, B.S. Ooi, Thermo-responsive properties of poly(N-isopropylacrylamide-co-acrylic acid) hydrogel and its effect on copper ion removal and fouling of polymer-enhanced ultrafiltration, Journal of Membrane Science, Volume 469, 1 November 2014
  • Zuwei Yin, Fuyi Chen, A facile electrochemical fabrication of hierarchically structured nickel–copper composite electrodes on nickel foam for hydrogen evolution reaction, Journal of Power Sources, Volume 265, 1 November 2014
  • W.H. Zhou, H. Guo, Z.J. Xie, C.J. Shang, R.D.K. Misra, Copper precipitation and its impact on mechanical properties in a low carbon microalloyed steel processed by a three-step heat treatment, Materials & Design, Volume 63, November 2014
  • Xiaofan Du, Tong Gao, Yuying Wu, Xiangfa Liu, Effects of copper addition on the in-situ synthesis of SiC particles in Al–Si–C–Cu system, Materials & Design, Volume 63, November 2014
  • C. Dang, Q.L. Che, B.L. Gao, L. Li, B.B. Wang, Growth, photoluminescence and thermal conductance of graphene-like nanoflakes grown on copper foils in methane environment, Materials Science in Semiconductor Processing, Volume 27, November 2014
  • M. Somasundaram, R. Saravanathamizhan, C. Ahmed Basha, V. Nandakumar, S. Nathira Begum, T. Kannadasan, Recovery of copper from scrap printed circuit board: modelling and optimization using response surface methodology, Powder Technology, Volume 266, November 2014