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Nickel-Copper Sputtering Target
Ni/Cu
7440-02-0/7440-50-8
Product
Product Code
Order or Specifications
99% Nickel-Copper Sputtering Target
NI-CU-02-ST
Contact American Elements
99.5% Nickel-Copper Sputtering Target
NI-CU-025-ST
Contact American Elements
99.9% Nickel-Copper Sputtering Target
NI-CU-03-ST
Contact American Elements
99.95% Nickel-Copper Sputtering Target
NI-CU-035-ST
Contact American Elements
99.99% Nickel-Copper Sputtering Target
NI-CU-04-ST
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99.999% Nickel-Copper Sputtering Target
NI-CU-05-ST
Contact American Elements
See research below. American Elements specializes in producing high purity Nickel-Copper Sputtering targets with the highest possible density High Purity (99.99%) Metallic Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. We also produce Nickel as rods, powder and plates. Other shapes are available by request.

Nickel is a Block D, Group 4, Period 4 element. The electronic configuration is [Ar]3d84s2. In its elemental form nickel's CAS number is 7440-02-0. The nickel atom has a radius of 149.pm and it's Van der Waals radius is 163.pm. It is extensively alloyed with iron, chromium, molybdenum, tungsten and other metals produce stainless and other anti-corrosive steel and other corrosion-resistant alloys. It is highly electronically conductive and has many applications as a result. It is the basis of the nickel hydride battery. Most recently, its conductive properties have made it an ideal component for ceramic anode formulations used in oxygen generation and solid oxide fuel cell applications. Catalytic nickel is used to hydrogenate vegetable oils. Nickel additions to glass and ceramic glazes impart a bright green. It is also used in pigments for this purpose. Nickel information, including Technical Data, Safety Data and its high purity properties, research, applications and other useful facts are discussed below. Scientific facts such as the atomic structure, ionization energy, abundance on Earth, conductivity and thermal properties are included. Nickel was first discovered by Alex Constedt in 1751.

Copper is a Block D, Group 11, Period 4 element. The electronic configuration is [Ar] 3d10 4s1. In its elemental form copper's CAS number is 7440-50-8. The copper atom has a radius of 127.8 .pm and it's Van der Waals radius is 140.pm. Due to its high electrical conductivity, large amounts of copper are used by the electrical industry for wire. Of all pure metals, only silver has a higher electrical conductivity. Copper is also resistant to corrosion caused by moisture, making it a widely used material in pipes, coins, and jewelry. Copper is often too soft for its applications, so it is incorporated in numerous alloys. For example, brass is a copper-zinc alloy, and bronze is a copper-tin alloy. Copper sulfate (CuSO 4·H2O), also known as blue vitrol, is the most well-known copper compound. It is used as an agricultural poison, an algicide, and as a pigment for inks. Cuprous chloride (CuCl) is a powder used to absorb carbon dioxide (CO2). Copper cyanide (CuCN) is often used in electroplating applications. Copper is available as metal and compounds with purities from 99% to 99.9999% (ACS grade to ultra-high purity); metals in the form of foil, sputtering target, and rod, and compounds as submicron and nanopowder.

Nickel is extensively alloyed with iron, chromium, molybdenum, tungsten and other metals produce stainless and other anti-corrosive steel and other corrosion-resistant alloys. It is highly electronically conductive and has many applications as a result. It is the basis of the nickel hydride battery. Most recently, its conductive properties have made it an ideal component for ceramic anode formulations used in oxygen generation and solid oxide fuel cell applications. Catalytic nickel is used to hydrogenate vegetable oils. Nickel additions to glass and ceramic glazes impart a bright green. It is also used in pigments for this purpose.

Formula CAS No. Appearance Molecular Weight
Ni/Cu 7440-02-0/7440-50-8 Metal
PRODUCT CATALOG Submicron & Nanopowder Tolling Ultra High Purity Sputtering Target Crystal Growth Rod, Plate, Powder, etc.
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Periodic table of the elements science and academic information, elements and advanced materials data, scientific presentations and all pages, designs, concepts, logos, and color schemes herein are the copyrighted proprietary rights and intellectual property of American Elements. American Elements is a U.S. Registered Trademark. © 2001-2009. American Elements. All rights reserved.

 

Recent Research & Development for Nickel

  • In vitro frictional forces generated by three different ligation methods. Angle Orthod. 2008 Sep;78(5):917-21.

  • Osteotomy assisted maxillary posterior impaction with miniplate anchorage. Angle Orthod. 2008 Jul;78(4):737-44.

  • Equilibrium, thermodynamic and kinetic studies for the biosorption of aqueous lead(II), cadmium(II) and nickel(II) ions on Spirulina platensis. J Hazard Mater. 2008 Jun 15;154(1-3):973-980. Epub 2007 Nov 9.

  • Integrated bacterial process for the treatment of a spent nickel catalyst. J Hazard Mater. 2008 Jun 15;154(1-3):804-10. Epub 2007 Nov 4.

  • Template synthesis of novel carboxamide dinuclear copper (II) complex: spectral characterization and reactivity towards calf-thymus DNA. Biometals. 2008 Jun;21(3):299-310. Epub 2007 Oct 26.

  • Effects of inoculation of plant-growth promoting bacteria on Ni uptake by Indian mustard. Bioresour Technol. 2008 Jun;99(9):3491-8. Epub 2007 Sep 10.

  • A new chlorophycean nickel hyperaccumulator. Bioresour Technol. 2008 Jun;99(9):3930-4. Epub 2007 Sep 10.

  • Magnetic susceptibility and electrical conductivity of metallic dental materials and their impact on MR imaging artifacts. Dent Mater. 2008 Jun;24(6):715-23. Epub 2007 Sep 19.

  • A mathematical model of the in vitro keratinocyte response to chromium and nickel exposure. Toxicol In Vitro. 2008 Jun;22(4):1088-93. Epub 2008 Feb 9.

  • Investigative studies for the use of an inactive asbestos mine as a disposal site for asbestos wastes. J Hazard Mater. 2008 May 30;153(3):955-65. Epub 2007 Sep 21.

  • Influence of pH, curing time and environmental stress on the immobilization of hazardous waste using activated fly ash. J Hazard Mater. 2008 May 30;153(3):1103-9. Epub 2007 Sep 25.

  • Nickel(II) complexes with Schiff-base ligands derived from epimeric pyranose backbones as 2,3-chelators: modeling the coordination chemistry of chitosan. Carbohydr Res. 2008 May 19;343(7):1266-77. Epub 2008 Feb 5.

  • The intrinsic dynamics and function of nickel-binding regulatory protein: insights from elastic network analysis. Biophys J. 2008 May 15;94(10):3769-78. Epub 2008 Jan 28.

  • Critical overview of Nitinol surfaces and their modifications for medical applications. Acta Biomater. 2008 May;4(3):447-67. Epub 2008 Feb 6.

  • Anisotropy of nickel release and corrosion in austenitic stainless steels. Acta Biomater. 2008 May;4(3):680-5. Epub 2007 Nov 20.

  • Nickel alterations of TLR2-dependent chemokine profiles in lung fibroblasts are mediated by COX-2. Am J Respir Cell Mol Biol. 2008 May;38(5):591-9. Epub 2007 Dec 20.

  • Force magnitude and duration effects on amount of tooth movement and root resorption in the rat molar. Angle Orthod. 2008 May;78(3):502-9.

  • Determination of Trace Elements in Jinqi, a Traditional Chinese Medicine. Biol Trace Elem Res. 2008 May;122(2):122-126. Epub 2008 Jan 5.

  • Biosorption of nickel(II) ions by baker's yeast: Kinetic, thermodynamic and desorption studies. Bioresour Technol. 2008 May;99(8):3100-9. Epub 2007 Aug 1.

  • Direct effects of heavy metal pollution on the immune function of a geometrid moth, Epirrita autumnata. Chemosphere. 2008 May;71(10):1840-4. Epub 2008 Mar 21.

 

 

 

 

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