American Elements: Ruthenium Sputtering Target Supplier and Tech Info

See research below. American Elements specializes in producing high purity Ruthenium sputtering targets with the highest possible density

and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devises as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. We also produce Ruthenium as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.

Ruthenium is a Block D, Group 8, Period 5 element. The electronic configuration is [Kr] 4d⁷ 5s¹. In its elemental form ruthenium's CAS number is 7440-18-8. The ruthenium atom has a radius of 132.5.pm and it's Van der Waals radius is 200.pm. Ruthenium is member of the platinum group of metals. It is one of the most effective hardeners for platinum and palladium , and is alloyed with these metals to make electrical contacts for severe wear resistanant electronics and laboratory equipment. The corrosion resistance of titanium is improved a hundredfold by addition of 0.1% ruthenium. It is also a versatile catalyst. Hydrogen sulfide can be split catalytically by light using an aqueous suspension of cadmium sulfide particles loaded with ruthenium dioxide. It is also believed to have pharmacological applications. Ruthenium is available as metal and compounds with purities from 99% to 99.999% (ACS grade to ultra-high purity); metals in the form of foil, sputtering target, and rod, and compounds as submicron and nanopowder.

Ruthenium Sputtering Target High Purity Ru Sputtering Target 7440-18-8

Ruthenium Sputtering Target
High Purity Ru Sputtering Target
7440-18-8