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Silicon Powder
High Purity Si Powder
7440-21-3
Product
Product Code
Order or Specifications
99% Silicon Powder
SI-M-02-P
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99.9% Silicon Powder
SI-M-03-P
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99.99% Silicon Powder
SI-M-04-P
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99.999% Silicon Powder
SI-M-05-P
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American Elements specializes in producing high purity Silicon Powder with the smallest possible average grain sizes for use in preparation of pressed and bonded sputtering targets and in Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Powders are also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications. Nanoparticles (See also Nanotechnology Information and Quantum Dots) also produce very high surface areas. Our standard Powder particle sizes average in the range of - 325 mesh, - 100 mesh, 10-50 microns and submicron (< 1 micron). We can also provide many materials in the nanoscale range. See research below. We also produce Silicon as rod, ingot, pieces, pellets, disc, granules, wire, and in compound forms, such as oxide. Other shapes are available by request.

Silicon is a Block P, Group 14, Period 3 element. The electronic configuration is [Ne] 3s2 3p2. In its elemental form silicon's CAS number is 7440-21-3. The silicon atom has a radius of 117.6.pm and it's Van der Waals radius is 210.pm. Silicon is one of man's most useful elements. It makes up 25.7% of the earth's crust, by weight, and is the second most abundant element, being exceeded only by oxygen. The Czochralski process is commonly used to produce single crystals of silicon used for solid-state or semiconductor devices. Silica, as sand, is a principal ingredient of glass, one of the most inexpensive of materials with excellent mechanical, optical, thermal, and electrical properties.

Formula CAS No. Appearance Molecular Weight Density Melting Point Boiling Point
Si 7440-21-3 Silvery 28.08 2330 kg/m³ 1414 °C 2900 °C
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Recent Research & Development for Silicon

  • Metal patterning on silicon surface by site-selective electroless deposition through colloidal crystal templating. J Colloid Interface Sci. 2007 Oct 1; [Epub ahead of print]

  • Initial site of bile regurgitation following extrahepatic biliary obstruction in living rats. J Gastroenterol Hepatol. 2007 Nov;22(11):1983-92.

  • Analytical Performance of a Venturi-Assisted Array of Micromachined Ultrasonic Electrosprays Coupled to Ion Trap Mass Spectrometry for the Analysis of Peptides and Proteins. Anal Chem. 2007 Oct 3; [Epub ahead of print]

  • Silicon-based microfilters for whole blood cell separation. Biomed Microdevices. 2007 Oct 4; [Epub ahead of print]

  • The role of aluminium and silicon in the setting chemistry of glass ionomer cements. J Mater Sci Mater Med. 2007 Oct 4; [Epub ahead of print]

  • Thin films of SiO(2) and hydroxyapatite on titanium deposited by spray pyrolysis. J Mater Sci Mater Med. 2007 Oct 4; [Epub ahead of print]

  • Exploration of the use of novel SiO(2) nanocomposites doped with fluorescent Eu(3+)/sensitizer complex for latent fingerprint detection. Forensic Sci Int. 2007 Oct 1; [Epub ahead of print]

  • Implant surface analysis and microbiologic evaluation of failed implants retrieved from smokers. J Oral Implantol. 2007;33(4):232-8.

  • Assembly of nanosize metallic particles and molecular wires on electrode surfaces. Chem Commun (Camb). 2007 Oct 21;(39):3983-9. Epub 2007 May 29.

  • Characterization of the calcification of cardiac valve bioprostheses by environmental scanning electron microscopy and vibrational spectroscopy. J Microsc. 2007 Oct;228(Pt 1):62-77.

  • Remotely adjustable check-valves with an electrochemical release mechanism for implantable biomedical microsystems.
    Biomed Microdevices. 2007 Jan 25; [Epub ahead of print]

  • Implantable microscale neural interfaces.
    Biomed Microdevices. 2007 Jan 25; [Epub ahead of print]

  • Towards electrically conductive, self-healing materials.
    J R Soc Interface. 2007 Jan 3; [Epub ahead of print]

  • Skin capacitance imaging of acne lesions.
    Skin Res Technol. 2007 Feb;13(1):9-12.

  • Effects of charge and size on condensation of supersaturated water vapor on nanoparticles of SiO(2).
    J Chem Phys. 2007 Jan 21;126(3):034701.

  • Electronic Properties of Si and Ge Atoms Doped In Clusters: In(n)()Si(m)() and In(n)()Ge(m)().
    J Phys Chem A Mol Spectrosc Kinet Environ Gen Theory. 2007 Feb 1;111(4):573-7.

  • Molecular Recognition Forces between Immunoglobulin G and a Surface Protein Adhesin on Living Staphylococcus aureus.
    Langmuir. 2007 Jan 24; [Epub ahead of print]

  • Syntheses and X-ray Diffraction, Photochemical, and Optical Characterization of Cu(2)Si(x)()Sn(1-)(x)()S(3) (0.4 </= x </= 0.6) for Photovoltaic Applications.
    Inorg Chem. 2007 Jan 24; [Epub ahead of print]

  • Adsorption of Trimethoxysilane and of 3-Mercaptopropyltrimethoxysilane on Silica and on Silicon Wafers from Vapor Phase: An IR Study.
    Langmuir. 2007 Jan 23; [Epub ahead of print]

  • Comparison of Protein Surface Attachment on Untreated and Plasma Immersion Ion Implantation Treated Polystyrene: Protein Islands and Carpet.
    Langmuir. 2007 Jan 23; [Epub ahead of print]

 

 

 

 

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