Tin Disk

High Purity Sn Disk
CAS 7440-31-5


Product Product Code Order or Specifications
(2N) 99% Tin Disk SN-M-02-D Contact American Elements
(2N5) 99.5% Tin Disk SN-M-025-D Contact American Elements
(3N) 99.9% Tin Disk SN-M-03-D Contact American Elements
(3N5) 99.95% Tin Disk SN-M-03-D Contact American Elements
(4N) 99.99% Tin Disk SN-M-04-D Contact American Elements
(5N) 99.999% Tin Disk SN-M-05-D Contact American Elements
(6N) 99.9999% Tin Disk SN-M-06-D Contact American Elements

CHEMICAL
IDENTIFIER		 Formula CAS No. PubChem SID PubChem CID MDL No. EC No Beilstein
Re. No.		 SMILES
Identifier 		InChI
Identifier		 InChI
Key
Sn 7440-31-5 166491 N/A MFCD00133862  231-141-8 N/A [Sn] InChI=1S/Sn ATJFFYVFTNAWJD-UHFFFAOYSA-N

PROPERTIES Mol. Wt. Appearance Density Tensile Strength Melting Point Boiling Point Thermal Conductivity Electrical Resistivity Eletronegativity Specific Heat Heat of Vaporization Heat of Fusion MSDS
118.69 Yellow 7310 kg/m³ N/A 231.93 °C 2602 °C 0.668 W/cm/K @ 298.2 K  11.0 microhm-cm @ °C 1.8 Paulings  0.0510 Cal/g/K @ 25 °C 70 K-Cal/gm atom at 2270 °C 1.72 Cal/gm mole  Safety Data Sheet

High Purity (99.99%) Metallic DiscAmerican Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopeia/British Pharmacopeia) and follows applicable ASTM testing standards.See safety data and research below and pricing/lead time above. American Elements specializes in producing Tin Disks in various thicknesses and sizes. Most Disks are produced from cast Ingots for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Thickness can range from 0.04" to 0.25" for all metals. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. We also produce Tin as rods, powder and plates. Other shapes are available by request.

Tin(Sn) atomic and molecular weight, atomic number and elemental symbolTin is a Block P, Group 14, Period 5 element. The number of electrons in each of Tin's shells is 2, 8, 18, 18, 4 and its electronic configuration is [Kr] 4d10 5s2 5p2. In its elemental form tin's CAS number is 7440-31-5. The tin atom has a radius of 140.5.pm and its Van der Waals radius is 217.pm. Tin salts and organometallic compounds of tin are very toxic, but tin in the form of single atoms or molecules is not toxic. Tin compounds sprayed onto glass are used to produce electrically conductive coatings. These have been used for panel lighting and for frost-free windshields. Most window glass is now made by floating molten glass on molten tin (float glass) to produce a flat surface. Crystalline tin-niobium alloy is superconductive at very low temperatures. Thispromises to be important in the construction of superconductive magnets that generate enormous field strengths but use practically no power. Tin (Sn) Bohr ModelScientists have recently been investigating tin's potential for use in lithium-ion batteries; in January 2013, a team of researchers from the University of Maryland, College Park developed a new method of synthesizing tin-carbon nanocomposites that could help simultaneously increase the storage capacity of the battery cell while preventing it from breaking under the strain. Elemental Tin Tin is the basis for many eutectic alloys and the discovery by early man that copper could be better formed and crafted if tin were added producing the first bronze and launching what we refer to as the "Bronze Age" and the first Neolithic metal tools, cooking utensils, and jewelry produced from rudimentary bronze. An important tin compound is the chloride, which is used as a reducing agent and as a mordant in calico printing. Tin is also used in various metal alloys (See AE Alloys). Tin, first discovered by Early Man, is commonly extracted from the mineral cassiterite, SnO2. The origin of the word tin comes from the Latin word Stannum which translates to the Anglo-Saxon word tin. See Tin research below.

HEALTH, SAFETY & TRANSPORTATION INFORMATION
Warning
H319-H335 
Xi
36/37
26
XP7320000
N/A
3
Exclamation Mark-Acute Toxicity        

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PACKAGING SPECIFICATIONS FOR BULK & RESEARCH QUANTITIES
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Material Safety Data Sheet (MSDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes.


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Recent Research & Development for Tin

  • Record Mobility in Transparent p-Type Tin Monoxide Films and Devices by Phase Engineering. Caraveo-Frescas JA, Nayak PK, Al-Jawhari HA, Granato DB, Schwingenschlögl U, Alshareef HN. ACS Nano. 2013 May 13. [Epub ahead of print]
  • Coaxial NixCo2x(OH)6x/TiN Nanotube Arrays as Supercapacitor Electrodes. Shang C, Dong S, Wang S, Xiao D, Han P, Wang X, Gu L, Cui G. ACS Nano. 2013 May 9. [Epub ahead of print]
  • Indium tin oxide nanowires grown by one-step thermal evaporation-deposition process at low temperature. Dong H, Zhang X, Niu Z, Zhao D, Li J, Cai L, Zhou W, Xie S. J Nanosci Nanotechnol. 2013 Feb;13(2):1300-3.
  • A comparative study of fine polished stainless steel, TiN and TiN/Ag surfaces: Adhesion and attachment strength of Listeria monocytogenes as well as anti-listerial effect. Skovager A, Whitehead K, Wickens D, Verran J, Ingmer H, Arneborg N. Colloids Surf B Biointerfaces. 2013 Apr 8;109C:190-196. doi: 10.1016/j.colsurfb.2013.03.044. [Epub ahead of print]
  • Diaqua-bis-(2-hy-droxy-benzoato-?O (1))bis-(nicotinamide-?N (1))cadmium-diaqua-bis-(2-hy-droxy-benzoato-?(2) O (1),O (1'))(nico-tin-amide-?N)cadmium-water (1/2/4). Caylak Delibas N, Necefoglu H, Hökelek T. Acta Crystallogr Sect E Struct Rep Online. 2013 Mar 9;69(Pt 4):m191-2. doi: 10.1107/S1600536813006168. Print 2013 Apr 1.
  • The maximum limiting performance improved counter electrode based on a porous fluorine doped tin oxide conductive framework for dye-sensitized solar cells. Bao C, Huang H, Yang J, Gao H, Yu T, Liu J, Zhou Y, Li Z, Zou Z. Nanoscale. 2013 Apr 30. [Epub ahead of print]
  • Development of a reagentless electrochemiluminescent electrode for flow injection analysis using copolymerised luminol/aniline on nano-TiO2 functionalised indium-tin oxide glass. Liu C, Wei X, Tu Y. Talanta. 2013 Jul 15;111C:156-62. doi: 10.1016/j.talanta.2013.02.068. Epub 2013 Mar 13.
  • Electrical impedance characterization of adipose tissue-derived stem cells cultured on indium tin oxide electrodes. Jun HS, Choi W, Kim JY, Cho S. J Biomed Nanotechnol. 2013 Apr;9(4):699-702.
  • Synthesis and Mössbauer Spectroscopy of Formal Tin(II) Dichloride and Dihydride Species Supported by Lewis Acids and Bases. Al-Rafia SM, Shynkaruk O, McDonald SM, Liew SK, Ferguson MJ, McDonald R, Herber RH, Rivard E. Inorg Chem. 2013 May 6;52(9):5581-9. doi: 10.1021/ic4005455. Epub 2013 Apr 25.
  • UV-Visible Spectroscopic Analysis of Electrical Properties in Alkali Metal-Doped Amorphous Zinc Tin Oxide Thin-Film Transistors. Lim KH, Kim K, Kim S, Park SY, Kim H, Kim YS. Adv Mater. 2013 Apr 25. doi: 10.1002/adma.201204236. [Epub ahead of print]
  • Electrooxidative grafting of amine-terminated dendrimers encapsulating nanoparticles for spatially controlled surface functionalization of indium tin oxide. Lee SB, Ju Y, Kim Y, Koo CM, Kim J. Chem Commun (Camb). 2013 Apr 24. [Epub ahead of print]
  • Tin(ii) fluoride vs. tin(ii) chloride - a comparison of their coordination chemistry with neutral ligands. Gurnani C, Hector AL, Jager E, Levason W, Pugh D, Reid G. Dalton Trans. 2013 Apr 24. [Epub ahead of print]
  • Accuracy of iodine removal using dual-energy CT with or without a tin filter: an experimental phantom study. Kawai T, Takeuchi M, Hara M, Ohashi K, Suzuki H, Yamada K, Sugimura Y, Shibamoto Y. Acta Radiol. 2013 Apr 23. [Epub ahead of print]
  • [A cohort study on risk factors of lung cancer in yunnan tin miners]. Liu X, Fan Y, Jiang Y, Xiang J, Wang J, Sun Z, Ren G, Yao S, Chang R, Zhao Y, Qiao Y, Zhou Q. Zhongguo Fei Ai Za Zhi. 2013 Apr 20;16(4):184-90. doi: 10.3779/j.issn.1009-3419.2013.04.03. Chinese.
  • A hierarchical hybrid design for high performance tin based Li-ion battery anodes. Song X. Nanotechnology. 2013 May 24;24(20):205401. doi: 10.1088/0957-4484/24/20/205401. Epub 2013 Apr 19.
  • Effect of tin-chloride pretreatment on bond strength of two adhesive systems to dentin. Peutzfeldt A, Koch T, Ganss C, Flury S, Lussi A. Clin Oral Investig. 2013 Apr 17. [Epub ahead of print]
  • Phosphastannirane: A Phosphorus/Tin(II) Lewis Pair that Undergoes Alkyne and Alkene Addition. Freitag S, Henning J, Schubert H, Wesemann L. Angew Chem Int Ed Engl. 2013 May 17;52(21):5640-3. doi: 10.1002/anie.201301153. Epub 2013 Apr 15.
  • Enhanced Hematite Water Electrolysis Using a 3D Antimony-Doped Tin Oxide Electrode. Moir J, Soheilnia N, O'Brien P, Jelle A, Grozea CM, Faulkner D, Helander M, Ozin GA. ACS Nano. 2013 Apr 12. [Epub ahead of print]
  • Impact of preferential indium nucleation on electrical conductivity of vapor-liquid-solid grown indium-tin oxide nanowires. Meng G, Yanagida T, Nagashima K, Yoshida H, Kanai M, Klamchuen A, Zhuge F, He Y, Rahong S, Fang X, Takeda S, Kawai T. J Am Chem Soc. 2013 May 8;135(18):7033-8. doi: 10.1021/ja401926u. Epub 2013 Apr 29.
  • Does tin pre-treatment enhance the bond strength of adhesive systems to enamel? Schlueter N, Peutzfeldt A, Ganss C, Lussi A. J Dent. 2013 Apr 9. doi:pii: S0300-5712(13)00089-4. 10.1016/j.jdent.2013.03.009. [Epub ahead of print]