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Bronze Electrodes

Linear Formula:

Cu Sn


(2N) 99% Bronze Electrode
BRZ-ALLY-02-EL Pricing > SDS > Data Sheet >
(3N) 99.9% Bronze Electrode
BRZ-ALLY-03-EL Pricing > SDS > Data Sheet >
(4N) 99.99% Bronze Electrode
BRZ-ALLY-04-EL Pricing > SDS > Data Sheet >
(5N) 99.999% Bronze Electrode
BRZ-ALLY-05-EL Pricing > SDS > Data Sheet >




Health & Safety Info  |  MSDS / SDS

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
Transport Information N/A


American Elements specializes in producing high purity uniform shaped Bronze Electrodes with the highest possible density and smallest possible average grain sizes for use in semiconductor, Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). American Elements produces high purity Bronze Electrodes which can be used in chemical and physics experiments related to mass and heat conductivity or for demonstration purposes. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics.



Chemical Identifiers

Linear Formula

Cu Sn

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Products & Element Information

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a red-orange metallic luster appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity.The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus." Cyprus, a Mediterranean island, was known as an ancient source of mined copper.

Tin Bohr ModelSee more Tin products. Tin (atomic symbol: Sn, atomic number: 50) is a Block P, Group 14, Period 5 element with an atomic weight of 118.710. The number of electrons in each of tin's shells is 2, 8, 18, 18, 4 and its electron configuration is [Kr] 4d10 5s2 5p2. The tin atom has a radius of 140.5 pm and a Van der Waals radius of 217 pm.In its elemental form, tin has a silvery-gray metallic appearance. It is malleable, ductile and highly crystalline. High Purity (99.9999%) Tin (Sn) MetalTin has nine stable isotopes and 18 unstable isotopes. Under 3.72 degrees Kelvin, Tin becomes a superconductor. Applications for tin include soldering, plating, and such alloys as pewter. The first uses of tin can be dated to the Bronze Age around 3000 BC in which tin and copper were combined to make the alloy bronze. The origin of the word tin comes from the Latin word Stannum which translates to the Anglo-Saxon word tin. For more information on tin, including properties, safety data, research, and American Elements' catalog of tin products, visit the Tin element page.

Recent Research

Facile fabrication of Fe3O4 octahedra/nanoporous copper network composite for high-performance anode in Li-Ion batteries., Ye, Jiajia, Wang Zhihong, Hao Qin, Liu Binbin, and Xu Caixia , J Colloid Interface Sci, 2017 May 01, Volume 493, p.171-180, (2017)

Synthesis and characterizations of biscuit-like copper oxide for the non-enzymatic glucose sensor applications., Velmurugan, Murugan, Karikalan Natarajan, and Chen Shen-Ming , J Colloid Interface Sci, 2017 May 01, Volume 493, p.349-355, (2017)

Ultra fast ultrasound-assisted decopperization from copper anode slime., Wang, Shixing, Cui Wei, Zhang Gengwei, Zhang Libo, and Peng Jinhui , Ultrason Sonochem, 2017 May, Volume 36, p.20-26, (2017)

Ultrafast self-assembly of silver nanostructures on carbon-coated copper grids for surface-enhanced Raman scattering detection of trace melamine., Cao, Qi, Yuan Kaiping, Yu Jun, Delaunay Jean-Jacques, and Che Renchao , J Colloid Interface Sci, 2017 Mar 15, Volume 490, p.23-28, (2017)

The interaction of surfactants with plastic and copper plumbing materials during decontamination., Casteloes, Karen S., Mendis Gamini P., Avins Holly K., Howarter John A., and Whelton Andrew J. , J Hazard Mater, 2017 Mar 05, Volume 325, p.8-16, (2017)

Copper exposure to soil under single and repeated application: Selection for the microbial community tolerance and effects on the dissipation of antibiotics., Liu, Bei, Li Yanxia, Gao Shiying, and Chen Xingcai , J Hazard Mater, 2017 Mar 05, Volume 325, p.129-135, (2017)

Overwhelming reaction enhanced by ultrasonics during brazing of alumina to copper in air by Zn-14Al hypereutectic filler., Ji, Hongjun, Chen Hao, and Li Mingyu , Ultrason Sonochem, 2017 Mar, Volume 35, Issue Pt A, p.61-71, (2017)

Does specific parameterization of WHAM improve the prediction of copper competitive binding and toxicity on plant roots?, Guigues, Stéphanie, Bravin Matthieu N., Garnier Cédric, and Doelsch Emmanuel , Chemosphere, 2017 Mar, Volume 170, p.225-232, (2017)

A survey on the effects of ultrasonic irradiation, reaction time and concentration of initial reagents on formation of kinetically or thermodynamically stable copper(I) metal-organic nanomaterials., Mirzadeh, Elham, Akhbari Kamran, Phuruangrat Anukorn, and Costantino Ferdinando , Ultrason Sonochem, 2017 Mar, Volume 35, Issue Pt A, p.382-388, (2017)

Eu(3+) amidst ionic copper in glass: Enhancement through energy transfer from Cu(+), or quenching by Cu(2+)?, Jiménez, José A. , Spectrochim Acta A Mol Biomol Spectrosc, 2017 Feb 15, Volume 173, p.979-985, (2017)


February 23, 2017
Los Angeles, CA
Each business day American Elements' scientists & engineers post their choice for the most exciting materials science news of the day

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