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Copper Aluminum Oxide Sputtering Target

CAS #:

Linear Formula:

CuAlO2

MDL Number:

N/A

EC No.:

235-483-9

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
(2N) 99% Copper Aluminum Oxide Sputtering Target
CU-ALO-02-ST
Pricing > SDS > Data Sheet >
(3N) 99.9% Copper Aluminum Oxide Sputtering Target
CU-ALO-03-ST
Pricing > SDS > Data Sheet >
(4N) 99.99% Copper Aluminum Oxide Sputtering Target
CU-ALO-04-ST
Pricing > SDS > Data Sheet >
(5N) 99.999% Copper Aluminum Oxide Sputtering Target
CU-ALO-05-ST
Pricing > SDS > Data Sheet >

Copper Aluminum Oxide Sputtering Target Properties (Theoretical)

Compound Formula CuAlO2
Molecular Weight 122.53
Appearance solid
Melting Point N/A
Boiling Point n1
Density N/A
Solubility in H2O N/A
Exact Mass 121.900965
Monoisotopic Mass 121.900965

Copper Aluminum Oxide Sputtering Target Health & Safety Information

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
Transport Information N/A
MSDS / SDS

About Copper Aluminum Oxide Sputtering Target

High Purity (99.99%) Copper Aluminum Oxide Sputtering TargetAmerican Elements specializes in producing high purity Copper Aluminum Oxide Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. We offer all shapes and configurations of targets compatible with all standard guns including circular, rectangular, annular, oval, "dog-bone," rotatable (rotary), multi-tiled and others in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Please contact us for information on lead time and pricing above.

Copper Aluminum Oxide Sputtering Target Synonyms

N/A

Chemical Identifiers

Linear Formula CuAlO2
MDL Number N/A
EC No. 235-483-9
Beilstein Registry No. N/A
Pubchem CID 44146798
IUPAC Name aluminum; copper(1+); oxygen(2-)
SMILES [O-2].[O-2].[Al+3].[Cu+]
InchI Identifier InChI=1S/Al.Cu.2O/q+3;+1;2*-2
InchI Key ZGNMHLIUGNCQDY-UHFFFAOYSA-N

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a red-orange metallic luster appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity.The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus." Cyprus, a Mediterranean island, was known as an ancient source of mined copper.

See more Aluminum products. Aluminum (or Aluminum) (atomic symbol: Al, atomic number: 13) is a Block P, Group 13, Period 3 element with an atomic weight of 26.9815386. It is the third most abundant element in the earth's crust and the most abundant metallic element. Aluminum Bohr Model Aluminum's name is derived from alumina, the mineral from which Sir Humphrey Davy attempted to refine it from in 1812. It wasn't until 1825 that Aluminum was first isolated by Hans Christian Oersted. Aluminum is a silvery gray metal that possesses many desirable characteristics. It is light, nonmagnetic and non-sparking. It stands second among metals in the scale of malleability, and sixth in ductility. It is extensively used in many industrial applications where a strong, light, easily constructed material is needed. Elemental AluminumAlthough it has only 60% of the electrical conductivity of copper, it is used in electrical transmission lines because of its light weight. Pure aluminum is soft and lacks strength, but alloyed with small amounts of copper, magnesium, silicon, manganese, or other elements it imparts a variety of useful properties. Aluminum was first predicted by Antoine Lavoisierin 1787 and first isolated by Friedrich Wöhler in 1827.

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October 14, 2019
Los Angeles, CA
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