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Copper Circle

High Purity Cu Metal Circles
CAS 7440-50-8


Product Product Code Request Quote
(2N) 99% Copper Circle CU-M-02-CRCL Request Quote
(3N) 99.9% Copper Circle CU-M-03-CRCL Request Quote
(4N) 99.99% Copper Circle CU-M-04-CRCL Request Quote
(5N) 99.999% Copper Circle CU-M-05-CRCL Request Quote
(6N) 99.9999% Copper Circle CU-M-06-CRCL Request Quote

CHEMICAL
IDENTIFIER
Formula CAS No. PubChem CID MDL No. EC No Beilstein
Re. No.
SMILES
Identifier
InChI
Identifier
InChI
Key
Cu 7440-50-8 23978 MFCD00010965 231-159-6 N/A [Cu] InChI=1S/Cu RYGMFSIKBFXOCR-UHFFFAOYSA-N

PROPERTIES Mol. Wt. Appearance Density Melting Point Boiling Point Thermal Conductivity Electrical Resistivity Eletronegativity Specific Heat Heat of Vaporization Heat of Fusion MSDS
63.55 Reddish Metal 8.96 g/cm3 1085°C 2562°C 401
W·m-1·K-1
1.673 μΩ-cm @ 20°C 1.90 Paulings 0.39 kJ/kg K 300.4 kJ·mol-1 13.26 kJ·mol-1 Safety Data Sheet

American Elements specializes in producing high purity Copper Circles with the highest possible densityand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical High Purity (99.99%) Metallic Circlevapor deposition (PVD) display and optical applications. Our standard Circle sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. We can also provide Circles outside this range. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles () and in the form of solutions and organometallics.American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. We also produce Copper as rod, pellets, powder, pieces, granules, ingot, wire, and in compound forms, such as oxide. Other shapes are available by request.

Copper Bohr ModelCopper (Cu) atomic and molecular weight, atomic number and elemental symbolCopper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a red-orange metallic luster appearance. Elemental Copper Of all pure metals, only silver has a higher electrical conductivity.The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus." Cyprus, a Mediterranean island, was known as an ancient source of mined copper. For more information on copper, including properties, safety data, research, and American Elements' catalog of copper products, visit the Copper element page.


HEALTH, SAFETY & TRANSPORTATION INFORMATION
Danger
H228-H400
F
11
16
GL5325000
UN 3089 4.1/PG 2
3
Flame-Flammables Environment-Hazardous to the aquatic environment      

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PACKAGING SPECIFICATIONS FOR BULK & RESEARCH QUANTITIES
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Material Safety Data Sheet (MSDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes.


Have a Question? Ask a Chemical Engineer or Material Scientist
Request an MSDS or Certificate of Analysis

Recent Research & Development for Copper

  • Crystal structure of tetra-kis-(μ3-2-{[1,1-bis-(hy-droxy-meth-yl)-2-oxidoeth-yl]imino-meth-yl}phenolato)tetra-copper(II) ethanol monosolvate 2.5-hydrate.. Wang W, Ran J.. Acta Crystallogr E Crystallogr Commun. 2015 Apr 22
  • Crystal structure of di-chlorido-bis-(methyl isonicotinate-κN)copper(II).. Ahadi E, Hosseini-Monfared H, Mayer P.. Acta Crystallogr E Crystallogr Commun. 2015 Apr 18
  • Copper, lead and zinc removal from metal contaminated wastewater by adsorption onto agricultural wastes.. Janyasuthiwong S, Phiri SM, Kijjanapanich P, Rene ER, Esposito G, Lens PN.. Environ Technol. 2015 May 22:1-33.
  • Co-solvent enhanced zinc oxysulfide buffer layers in Kesterite copper zinc tin selenide solar cells.. Steirer KX, Garris RL, Li JV, Dzara MJ, Ndione PF, Ramanathan K, Repins I, Teeter G, Perkins CL.. Phys Chem Chem Phys. 2015 May 22.
  • The relative importance of diet-related and waterborne effects of copper for a leaf-shredding invertebrate.. Zubrod JP, Englert D, Rosenfeldt RR, Wolfram J, Lüderwald S, Wallace D, Schnetzer N, Schulz R, Bundschuh M.. Environ Pollut. 2015 May 19
  • Low-current field-assisted assembly of copper nanoparticles for current collectors.. Liu L, Choi BG, Tung SO, Hu T, Liu Y, Li T, Zhao T, Kotov NA.. Faraday Discuss. 2015 May 21.
  • Toxic potential of copper-doped ZnO nanoparticles in Drosophila melanogaster (Oregon R).. Siddique YH, Haidari M, Khan W, Fatima A, Jyoti S, Khanam S, Naz F, Rahul, Ali F, Singh BR, Beg T, Mohibullah, Naqvi AH.. Toxicol Mech Methods. 2015 May 22:1-8.
  • Being two is better than one-catalytic reductions with dendrimer encapsulated copper- and copper-cobalt-subnanoparticles.. Ficker M, Petersen JF, Gschneidtner T, Rasmussen AL, Purdy T, Hansen JS, Hansen TH, Husted S, Moth Poulsen K, Olsson E, Christensen JB.. Chem Commun (Camb). 2015 May 22.
  • Sustainable Hydrogen Production by Ethanol Steam Reforming using a Partially Reduced Copper-Nickel Oxide Catalyst. Chen LC, Cheng H, Chiang CW, Lin SD. ChemSusChem. 2015 Apr 15.: ChemSusChem
  • Aerosol assisted CVD grown WO3 nanoneedles decorated with copper oxide nanoparticles for the selective and humidity resilient detection of H2S. Annanouch FE, Haddi Z, Vallejos S, Umek P, Guttmann P, Bittencourt C, Llobet E. ACS Appl Mater Interfaces. 2015 Mar 16.