CAS #:

Linear Formula:

CuF2

MDL Number:

MFCD00010977

EC No.:

232-147-3

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
(2N) 99% Copper Fluoride Sputtering Target
CU-F-02
Pricing > SDS > Data Sheet >
(3N) 99.9% Copper Fluoride Sputtering Target
CU-F-03
Pricing > SDS > Data Sheet >
(4N) 99.99% Copper Fluoride Sputtering Target
CU-F-04
Pricing > SDS > Data Sheet >
(5N) 99.999% Copper Fluoride Sputtering Target
CU-F-05
Pricing > SDS > Data Sheet >

Copper Fluoride Sputtering Target Properties (Theoretical)

Compound Formula CuF2
Molecular Weight 101.54
Appearance White crystalline target
Melting Point 836° C (1,537° F)
Boiling Point 1,676° C (3,049° F)
Density 4.23 g/cm3
Solubility in H2O N/A
Exact Mass 100.926
Monoisotopic Mass 100.926

Copper Fluoride Sputtering Target Health & Safety Information

Signal Word Danger
Hazard Statements H314
Hazard Codes C
Precautionary Statements P260-P280-P303 + P361 + P353-P304 + P340 + P310-P305 + P351 + P338
Flash Point Not applicable
Risk Codes 32-34
Safety Statements 26-36/37/39-45
RTECS Number N/A
Transport Information UN 3260 8 / PGII
WGK Germany 3
GHS Pictograms
MSDS / SDS

About Copper Fluoride Sputtering Target

American Elements specializes in producing high purity Copper fluoride sputtering targets with the highest possible density High Purity (99.99%) Copper Fluoride Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. We offer all shapes and configurations of targets compatible with all standard guns including circular, rectangular, annular, oval, "dog-bone," rotatable (rotary), multi-tiled and others in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce Copper Fluoride as rods, powder and plates. Other shapes are available by request. Ts of measurement.

Copper Fluoride Sputtering Target Synonyms

N/A

Chemical Identifiers

Linear Formula CuF2
MDL Number MFCD00010977
EC No. 232-147-3
Beilstein/Reaxys No. N/A
Pubchem CID 522688
IUPAC Name copper difluoride Sputtering Target
SMILES [Cu+2].[F-].[F-]
InchI Identifier InChI=1S/Cu.2FH/h;2*1H/q+2;;/p-2
InchI Key GWFAVIIMQDUCRA-UHFFFAOYSA-L

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Payment Methods

American Elements accepts checks, wire transfers, ACH, most major credit and debit cards (Visa, MasterCard, AMEX, Discover) and Paypal.

For the convenience of our international customers, American Elements offers the following additional payment methods:

SOFORT bank tranfer payment for Austria, Belgium, Germany and SwitzerlandJCB cards for Japan and WorldwideBoleto Bancario for BraziliDeal payments for the Netherlands, Germany, Austria, Belgium, Italy, Poland, Spain, Switzerland, and the United KingdomGiroPay for GermanyDankort cards for DenmarkElo cards for BrazileNETS for SingaporeCartaSi for ItalyCarte-Bleue cards for FranceChina UnionPayHipercard cards for BrazilTROY cards for TurkeyBC cards for South KoreaRuPay for India

Related Elements

Copper

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper..

Fluorine

Fluorine is a Block P, Group 17, Period 2 element. Its electron configuration is [He]2s22p5. The fluorine atom has a covalent radius of 64 pm and its Van der Waals radius is 135 pm. In its elemental form, CAS 7782-41-4, fluorine gas has a pale yellow appearance. Fluorine was discovered by André-Marie Ampère in 1810. It was first isolated by Henri Moissan in 1886.

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September 20, 2021
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