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Copper Powder

High Purity Cu Powder
CAS 7440-50-8

Product Product Code Request Quote
(2N) 99% Copper Powder CU-M-02-P Request Quote
(3N) 99.9% Copper Powder CU-M-03-P Request Quote
(4N) 99.99% Copper Powder CU-M-04-P Request Quote
(5N) 99.999% Copper Powder CU-M-05-P Request Quote
(6N) 99.9999% Copper Powder CU-M-06-P Request Quote

Formula CAS No. PubChem CID MDL No. EC No Beilstein
Re. No.
Cu 7440-50-8 23978 MFCD00010965 231-159-6 N/A [Cu] InChI=1S/Cu RYGMFSIKBFXOCR-UHFFFAOYSA-N

PROPERTIES Mol. Wt. Appearance Density Melting Point Boiling Point Thermal Conductivity Electrical Resistivity Eletronegativity Specific Heat Heat of Vaporization Heat of Fusion MSDS
63.55 Reddish Metal 8.96 g/cm3 1085°C 2562°C 401
1.673 μΩ-cm @ 20°C 1.90 Paulings 0.39 kJ/kg K 300.4 kJ·mol-1 13.26 kJ·mol-1 Safety Data Sheet

Ultra High Purity Metal PowdersAmerican Elements specializes in producing high purity Copper Powder with the smallest possible average grain sizes for use in preparation of pressed and bonded sputtering targets and in Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Powders are also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications. Nanoparticles () also produce very high surface areas. Our standard Powder particle sizes average in the range of - 325 mesh, - 100 mesh, 10-50 microns and submicron (< 1 micron). We can also provide many materials in the nanoscale range.American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. We also produce Copper as rod, ingot, pieces, pellets, disc, granules, wire, and in compound forms, such as oxide. Other shapes are available by request.

Copper Bohr ModelCopper (Cu) atomic and molecular weight, atomic number and elemental symbolCopper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a red-orange metallic luster appearance. Elemental Copper Of all pure metals, only silver has a higher electrical conductivity.The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus." Cyprus, a Mediterranean island, was known as an ancient source of mined copper. For more information on copper, including properties, safety data, research, and American Elements' catalog of copper products, visit the Copper element page.

UN 3089 4.1/PG 2
Flame-Flammables Environment-Hazardous to the aquatic environment      

Copper Oxide Copper Nitrate Copper Pellets Copper Acetylacetonate Copper Acetate
Copper Tin Silver Alloy Copper Metal Copper Oxide Pellets Copper Wire Copper Foil
Copper Chloride Copper Sputtering Target Copper Powder Copper Nanoparticles Aluminum Magnesium Copper Alloy
Show Me MORE Forms of Copper

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Material Safety Data Sheet (MSDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes.

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Recent Research & Development for Copper

  • Silver-Copper Nanoalloy Catalyst Layer for Bifunctional Air Electrodes in Alkaline Media., 2015 Jul 22, Wu X, Chen F, Jin Y, Zhang N, Johnston RL. ACS Appl Mater Interfaces. 2015 Jul 22,
  • The copper-catalyzed synthesis of β-trifluoromethylated acrylonitriles and trifluoromethyl-substituted 2H-azirines., 2015 Jul 21, He YT, Wang Q, Zhao J, Liu XY, Xu PF, Liang YM. Chem Commun (Camb). 2015 Jul 21,
  • Neuronal Copper Homeostasis Susceptibility by Genetic Defects in Dysbindin, a Schizophrenia Susceptibility Factor., 2015 Jul 21, Gokhale A, Vrailas-Mortimer A, Larimore J, Comstra HS, Zlatic SA, Werner E, Manvich DF, Iuvone PM, Weinshenker D, Faundez V. Hum Mol Genet. 2015 Jul 21,
  • A Chemical Route to Activation of Open Metal Sites in the Copper-Based Metal-Organic Framework Materials HKUST-1 and Cu-MOF-2., 2015 Jul 21, Kim HK, Yun WS, Kim MB, Kim JY, Bae YS, Lee J, Jeong NC. J Am Chem Soc. 2015 Jul 21,
  • Probing the active surface sites for CO reduction on oxide-derived copper electrocatalysts., 2015 Jul 21, Verdaguer-Casadevall A, Li CW, Johansson TP, Scott SB, McKeown JT, Kumar M, Stephens IE, Kanan MW, Chorkendorff I. J Am Chem Soc. 2015 Jul 21,
  • Copper Nanowires: A Substitute for Noble Metals to Enhance Photocatalytic H2 Generation., 2015 Jul 21, Xiao S, Liu P, Zhu W, Li G, Zhang D, Li H. Nano Lett. 2015 Jul 21,
  • Chemical Conversions of Biomass-Derived Platform Chemicals over Copper-Silica Nanocomposite Catalysts., 2015 Jul 20, Upare PP, Hwang YK, Lee JM, Hwang DW, Chang JS. ChemSusChem. 2015 Jul 20,
  • Metabolic Impacts of Using Nitrogen and Copper-Regulated Promoters to Regulate Gene Expression in Neurospora crassa., 2015 Jul 20, Ouyang S, Beecher CN, Wang K, Larive CK, Borkovich KA. G3 (Bethesda). 2015 Jul 20,
  • Homoleptic phosphino copper(i) complexes with in vitro and in vivo dual cytotoxic and anti-angiogenic activity., 2015 Jul 20, Gandin V, Trenti A, Porchia M, Tisato F, Giorgetti M, Zanusso I, Trevisi L, Marzano C. Metallomics. 2015 Jul 20,
  • The Trametes hirsuta 072 laccase multigene family: genes identification and transcriptional analysis under copper ions induction., 2015 Jul 18, Vasina DV, Mustafaev ON, Moiseenko KV, Sadovskaya NS, Glazunova OA, Tyurin АА, Fedorova TV, Pavlov AR, Tyazhelova TV, Goldenkova-Pavlova IV, Koroleva OV. Biochimie. 2015 Jul 18,