Manganese Copper Sputtering Target

Linear Formula:

Mn/Cu

MDL Number:

N/A

EC No.:

N/A

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
(2N) 99% Manganese Copper Sputtering Target
MN-CU-02-ST
Pricing > SDS > Data Sheet >
(3N) 99.9% Manganese Copper Sputtering Target
MN-CU-03-ST
Pricing > SDS > Data Sheet >
(4N) 99.99% Manganese Copper Sputtering Target
MN-CU-04-ST
Pricing > SDS > Data Sheet >
(5N) 99.999% Manganese Copper Sputtering Target
MN-CU-05-ST
Pricing > SDS > Data Sheet >

Manganese Copper Sputtering Target Properties (Theoretical)

Compound Formula MnCu
Appearance Target
Melting Point N/A
Boiling Point N/A
Density N/A
Solubility in H2O N/A
Monoisotopic Mass 117.868 g/mol

Manganese Copper Sputtering Target Health & Safety Information

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
Risk Codes N/A
Safety Statements N/A
Transport Information N/A

About Manganese Copper Sputtering Target

High Purity (99.99%) Manganese Copper Sputtering TargetAmerican Elements specializes in producing high purity Manganese Copper Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. We offer all shapes and configurations of targets compatible with all standard guns including circular, rectangular, annular, oval, "dog-bone," rotatable (rotary), multi-tiled and others in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Please contact us for information on lead time and pricing above.

Manganese Copper Sputtering Target Synonyms

CAS 12272-98-9, Copper-Manganese master alloy

Chemical Identifiers

Linear Formula Mn/Cu
MDL Number N/A
EC No. N/A
Pubchem CID 11446311
IUPAC Name copper; manganese
SMILES [Mn].[Cu]
InchI Identifier InChI=1S/Cu.Mn
InchI Key HPDFFVBPXCTEDN-UHFFFAOYSA-N

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Payment Methods

American Elements accepts checks, wire transfers, ACH, most major credit and debit cards (Visa, MasterCard, AMEX, Discover) and Paypal.

For the convenience of our international customers, American Elements offers the following additional payment methods:

SOFORT bank tranfer payment for Austria, Belgium, Germany and SwitzerlandJCB cards for Japan and WorldwideBoleto Bancario for BraziliDeal payments for the Netherlands, Germany, Austria, Belgium, Italy, Poland, Spain, Switzerland, and the United KingdomGiroPay for GermanyDankort cards for DenmarkElo cards for BrazileNETS for SingaporeCartaSi for ItalyCarte-Bleue cards for FranceChina UnionPayHipercard cards for BrazilTROY cards for TurkeyBC cards for South KoreaRuPay for India

Related Elements

Copper

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper..

Manganese

See more Manganese products. Manganese (atomic symbol: Mn, atomic number: 25) is a Block D, Group 7, Period 4 element with an atomic weight of 54.938045. Manganese Bohr ModelThe number of electrons in each of Manganese's shells is [2, 8, 13, 2] and its electron configuration is [Ar] 3d5 4s2. The manganese atom has a radius of 127 pm and a Van der Waals radius of 197 pm. Manganese was first discovered by Torbern Olof Bergman in 1770 and first isolated by Johann Gottlieb Gahn in 1774. In its elemental form, manganese has a silvery metallic appearance. Elemental ManganeseIt is a paramagnetic metal that oxidizes easily in addition to being very hard and brittle. Manganese is found as a free element in nature and also in the minerals pyrolusite, braunite, psilomelane, and rhodochrosite. The name Manganese originates from the Latin word mangnes, meaning "magnet."

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