Fabrication of a Bi₂Te₃-Based Thermoelectric Module Using Tin Electroplating and Thermocompression Bonding.

Author(s) Yoon, J.; Bae, S.Hwa; Sohn, H.S.; Son, I.; Park, K.H.; Cho, S.; Kim, K.Tae
Journal J Nanosci Nanotechnol
Date Published 2019 Mar 01
Abstract

A method for directly bonding thermoelectric elements onto copper electrodes without applying a solder paste was developed in this study. A tin coating of thickness approximately 50 m was deposited via electroplating onto the surface of a Bi₂Te₃-based thermoelectric element, which had a nickel diffusion barrier layer. The resulting structure was subsequently subjected to direct thermocompression bonding at 250 °C on a hotplate for 3 min at a pressure of 1.1 kPa. Scanning electron microscopy imaging confirmed that a strong and uniform bond was formed at the copper electrode-thermoelectric element interface, and the melted or solidified tin layer remained defect-free. The thermoelectric module fabricated using tin plating had an average bonding strength similar to that fabricated using soldering.

DOI 10.1166/jnn.2019.16230
ISSN 1533-4880
Citation Yoon J, Bae SH, Sohn H-, Son I, Park KH, Cho S, et al. Fabrication of a Bi₂Te₃-Based Thermoelectric Module Using Tin Electroplating and Thermocompression Bonding. J Nanosci Nanotechnol. 2019;19(3):1738-1742.