Nanofluidic Chip for Liquid TEM Cell Fabricated by Parylene and Silicon Nitride Direct Bonding.

Author(s) Jang, H.; Kang, I.S.; Kim, J.; Kim, J.; Cha, Y.Jeong; Yoon, D.Ki; Lee, W.
Journal Nanotechnology
Date Published 2017 Jul 24
Abstract

Despite the importance of nanofluidic TEM chips, a simple fabrication method has yet to be developed due to the difficulty of wafer bonding techniques using a nanoscale thick bonding layer. We present a simple and robust wafer scale bonding technique using parylene as a bonding layer. A nanoscale thick parylene layer was deposited on a SiN wafer and patterned to construct nanofluidic channels. The patterned parylene layer was directly bonded to another SiN wafer by thermal surface activation and bonding, with a bonding strength of ~3 MPa. Fourier transform infrared spectroscopy showed that carbon-oxygen bonds were generated by thermal activation. We demonstrated TEM imaging of gold nanoparticles suspended in liquid using the fabricated nanofluidic chip.

DOI 10.1088/1361-6528/aa8196
ISSN 1361-6528
Citation Jang H, Kang I-, Kim J, Kim J, Cha YJ, Yoon DK, et al. Nanofluidic Chip for Liquid TEM Cell Fabricated by Parylene and Silicon Nitride Direct Bonding. Nanotechnology. 2017.

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