Linear Formula:

Ag/Cu

MDL Number:

N/A

EC No.:

N/A

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
Silver/Copper Paste
AG-CU-01-PST
Pricing > SDS > Data Sheet >

Silver/Copper Eutectic Brazing Paste Properties (Theoretical)

Compound Formula Ag/Cu
Appearance Brown paste
Melting Point N/A
Boiling Point N/A
Density N/A
Solubility in H2O N/A

Silver/Copper Eutectic Brazing Paste Health & Safety Information

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
Risk Codes N/A
Safety Statements N/A
Transport Information NONH for all modes of transport

About Silver/Copper Eutectic Brazing Paste

Silver/Copper Eutectic Brazing Paste is a fluxless and fritless brazing paste suitable for screen printing. Silver/Copper paste is generally immediately available in most volumes, including bulk orders. American Elements can produce materials to custom specifications by request, in addition to custom compositions for commercial and research applications and new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as numerous other machined shapes and in the form of solutions and organometallic compounds. Ultra high purity and high purity forms also include metal powder, submicron powder and nanomaterials, targets for thin film deposition, and pellets for chemical vapor deposition (CVD) and physical vapor deposition (PVD) applications. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available, as is additional research, technical and safety (MSDS) data. Please contact us for information on lead time and pricing above.

Silver/Copper Eutectic Brazing Paste Synonyms

AgCu solder paste, conductive silver copper composite paste

Chemical Identifiers

Linear Formula Ag/Cu
MDL Number N/A
EC No. N/A

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

Copper

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper..

Silver

See more Silver products. Silver (atomic symbol: Ag, atomic number: 47) is a Block D, Group 11, Period 5 element with an atomic weight of 107.8682. Silver Bohr ModelThe number of electrons in each of Silver's shells is 2, 8, 18, 18, 1 and its electron configuration is [Kr]4d10 5s1. The silver atom has a radius of 144 pm and a Van der Waals radius of 203 pm. Silver was first discovered by Early Man prior to 5000 BC. In its elemental form, silver has a brilliant white metallic luster. Elemental SilverIt is a little harder than gold and is very ductile and malleable, being exceeded only by gold and perhaps palladium. Pure silver has the highest electrical and thermal conductivity of all metals and possesses the lowest contact resistance. It is stable in pure air and water, but tarnishes when exposed to ozone, hydrogen sulfide, or air containing sulfur. It is found in copper, copper-nickel, lead, and lead-zinc ores, among others. Silver was named after the Anglo-Saxon word "seolfor" or "siolfur," meaning 'silver'.

TODAY'S SCIENCE POST!

July 02, 2022
Los Angeles, CA
Each business day American Elements' scientists & engineers post their choice for the most exciting materials science news of the day

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