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Silver Tin Sputtering Target

Ag - Sn

MDL Number:

MFCD00801108

EC No.:

235-713-8

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
(2N) 99% Silver Tin Sputtering Target
AG-SN-02-ST
Pricing > SDS > Data Sheet >
(3N) 99.9% Silver Tin Sputtering Target
AG-SN-03-ST
Pricing > SDS > Data Sheet >
(4N) 99.99% Silver Tin Sputtering Target
AG-SN-04-ST
Pricing > SDS > Data Sheet >
(5N) 99.999% Silver Tin Sputtering Target
AG-SN-05-ST
Pricing > SDS > Data Sheet >

Silver Tin Sputtering Target Properties

Molecular Weight

226.5

Appearance

Target

Exact Mass

226.807 g/mol

Monoisotopic Mass

226.807 g/mol

Silver Tin Sputtering Target Health & Safety Information

Signal Word Warning
Hazard Statements H315-H319-H335
Hazard Codes Xi
Risk Codes 36/37/38
Safety Statements 26-36
RTECS Number N/A
Transport Information N/A
WGK Germany 3
MSDS / SDS

About Silver Tin Sputtering Target

American Elements specializes in producing high purity Silver Tin Sputtering Targets with the highest possible density High Purity (99.99%) Silver Tin Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes. We also produce Silver as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.

Silver Tin Sputtering Target Synonyms

tin-silver, silver-tin, Ag-Sn, AgSn, Sn-Ag, SnAg, Silver solder alloy, Silver, compound with tin (1:1), AgSn25, Ag3Sn

Silver Tin Sputtering Target Chemical Identifiers

Linear Formula

Ag - Sn

Pubchem CID

16218316

MDL Number

MFCD00801108

EC No.

235-713-8

IUPAC Name

silver; tin

SMILES

[Ag].[Sn]

InchI Identifier

InChI=1S/Ag.Sn

InchI Key

QCEUXSAXTBNJGO-UHFFFAOYSA-N

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Silver products. Silver (atomic symbol: Ag, atomic number: 47) is a Block D, Group 11, Period 5 element with an atomic weight of 107.8682. Silver Bohr ModelThe number of electrons in each of Silver's shells is 2, 8, 18, 18, 1 and its electron configuration is [Kr]4d10 5s1. The silver atom has a radius of 144 pm and a Van der Waals radius of 203 pm. Silver was first discovered by Early Man prior to 5000 BC. In its elemental form, silver has a brilliant white metallic luster. Elemental SilverIt is a little harder than gold and is very ductile and malleable, being exceeded only by gold and perhaps palladium. Pure silver has the highest electrical and thermal conductivity of all metals and possesses the lowest contact resistance. It is stable in pure air and water, but tarnishes when exposed to ozone, hydrogen sulfide, or air containing sulfur. It is found in copper, copper-nickel, lead, and lead-zinc ores, among others. Silver was named after the Anglo-Saxon word "seolfor" or "siolfur," meaning 'silver'.

Tin Bohr ModelSee more Tin products. Tin (atomic symbol: Sn, atomic number: 50) is a Block P, Group 14, Period 5 element with an atomic weight of 118.710. The number of electrons in each of tin's shells is 2, 8, 18, 18, 4 and its electron configuration is [Kr] 4d10 5s2 5p2. The tin atom has a radius of 140.5 pm and a Van der Waals radius of 217 pm.In its elemental form, tin has a silvery-gray metallic appearance. It is malleable, ductile and highly crystalline. High Purity (99.9999%) Tin (Sn) MetalTin has nine stable isotopes and 18 unstable isotopes. Under 3.72 degrees Kelvin, Tin becomes a superconductor. Applications for tin include soldering, plating, and such alloys as pewter. The first uses of tin can be dated to the Bronze Age around 3000 BC in which tin and copper were combined to make the alloy bronze. The origin of the word tin comes from the Latin word Stannum which translates to the Anglo-Saxon word tin. For more information on tin, including properties, safety data, research, and American Elements' catalog of tin products, visit the Tin element page.

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September 23, 2017
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