Tin Oxide, Tungsten doped Sputtering Target

WTO

Linear Formula:

SnO₂:W

MDL Number:

N/A

EC No.:

N/A

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PRODUCT	Product Code	ORDER	SAFETY DATA	TECHNICAL DATA
Tin Oxide, Tungsten doped Sputtering Target	SNO-W-01-ST	Pricing >	SDS >	Data Sheet >

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Tin Oxide, Tungsten doped Sputtering Target Properties (Theoretical)

Compound Formula	SnO₂:W
Appearance	Target
Melting Point	N/A
Boiling Point	N/A
Density	N/A
Solubility in H2O	N/A

Tin Oxide, Tungsten doped Sputtering Target Health & Safety Information

Signal Word	N/A
Hazard Statements	N/A
Hazard Codes	N/A
RTECS Number	N/A
Transport Information	N/A
MSDS / SDS	Request MSDS / SDS

About Tin Oxide, Tungsten doped Sputtering Target

American Elements specializes in producing high purity Tin Oxide, Tungsten doped Sputtering Targets with the highest possible density

High Purity (99.99%) Tin Oxide, Tungsten doped Sputtering Target

and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard sputtering targets for thin film deposition are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Rotary (cylindrical), round, rectangular, square, ring, annular, oval, "dog-bone" and other shaped targets are available in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Please request a quote above for more information on lead time and pricing.

Tin Oxide, Tungsten doped Sputtering Target Synonyms

WTO, Tungsten-doped tin dioxide, Tin tungstate

Chemical Identifiers

Linear Formula	SnO₂:W
MDL Number	N/A
EC No.	N/A

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Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Payment Methods

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Related Elements

Tin

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See more Tin products. Tin (atomic symbol: Sn, atomic number: 50) is a Block P, Group 14, Period 5 element with an atomic weight of 118.710. The number of electrons in each of tin's shells is 2, 8, 18, 18, 4 and its electron configuration is [Kr] 4d¹⁰ 5s² 5p². The tin atom has a radius of 140.5 pm and a Van der Waals radius of 217 pm.In its elemental form, tin has a silvery-gray metallic appearance. It is malleable, ductile and highly crystalline. High Purity (99.9999%) Tin (Sn) Metal Tin has nine stable isotopes and 18 unstable isotopes. Under 3.72 degrees Kelvin, Tin becomes a superconductor. Applications for tin include soldering, plating, and such alloys as pewter. The first uses of tin can be dated to the Bronze Age around 3000 BC in which tin and copper were combined to make the alloy bronze. The origin of the word tin comes from the Latin word Stannum which translates to the Anglo-Saxon word tin. For more information on tin, including properties, safety data, research, and American Elements' catalog of tin products, visit the Tin element page.

Tungsten

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