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Tin Silver Alloy

CAS #:

Linear Formula:

Sn-Ag

MDL Number:

MFCD00801108

EC No.:

235-713-8

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
Sn-90% Ag-10%
SN-AG-01-P.10AG
Pricing > SDS > Data Sheet >
Sn-92% Ag-8%
SN-AG-01-P.08AG
Pricing > SDS > Data Sheet >
Sn-93% Ag-7%
SN-AG-01-P.07AG
Pricing > SDS > Data Sheet >
Sn-95% Ag-5%
SN-AG-01-P.05AG
Pricing > SDS > Data Sheet >
Sn-96% Ag-4%
SN-AG-01-P.04AG
Pricing > SDS > Data Sheet >
Sn-96.5% Ag-03.5%
SN-AG-01-P.035AG
Pricing > SDS > Data Sheet >
Sn-97% Ag-3%
SN-AG-01-P.003AG
Pricing > SDS > Data Sheet >
Sn-97.5% Ag-2.5%
SN-AG-01-P.025AG
Pricing > SDS > Data Sheet >

Tin Silver Alloy Properties

Compound Formula

AgSn

Molecular Weight

226.5

Appearance

Metallic solid in various forms (plate, bar, sheet, sputtering target, powder)

Exact Mass

226.807 g/mol

Monoisotopic Mass

226.807 g/mol

Tin Silver Alloy Health & Safety Information

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
Transport Information N/A
MSDS / SDS

About Tin Silver Alloy

Tin Silver is one of numerous metal alloys sold by American Elements under the trade name AE Alloys™. Generally immediately available in most volumes, AE Alloys™ are available as bar, ingot, ribbon, wire, shot, sheet, and foil. Ultra high purity and high purity forms also include metal powder, submicron powder and nanoscale, targets for thin film deposition, and pellets for chemical vapor deposition (CVD) and physical vapor deposition (PVD) applications. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Primary applications include bearing assembly, ballast, casting, step soldering, and radiation shielding.

Tin Silver Alloy Synonyms

tin-silver, silver-tin, Ag-Sn, AgSn, Sn-Ag, SnAg, Silver solder alloy, Silver, compound with tin (1:1), AgSn25, Ag3Sn (CAS 12041-38-2), Ag4Sn (CAS 68785-73-9), Ag5Sn (CA 122097-26-1)

Tin Silver Alloy Chemical Identifiers

Linear Formula

Sn-Ag

Pubchem CID

16218316

MDL Number

MFCD00801108

EC No.

235-713-8

IUPAC Name

silver; tin

SMILES

[Ag].[Sn]

InchI Identifier

InChI=1S/Ag.Sn

InchI Key

QCEUXSAXTBNJGO-UHFFFAOYSA-N

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Silver products. Silver (atomic symbol: Ag, atomic number: 47) is a Block D, Group 11, Period 5 element with an atomic weight of 107.8682. Silver Bohr ModelThe number of electrons in each of Silver's shells is 2, 8, 18, 18, 1 and its electron configuration is [Kr]4d10 5s1. The silver atom has a radius of 144 pm and a Van der Waals radius of 203 pm. Silver was first discovered by Early Man prior to 5000 BC. In its elemental form, silver has a brilliant white metallic luster. Elemental SilverIt is a little harder than gold and is very ductile and malleable, being exceeded only by gold and perhaps palladium. Pure silver has the highest electrical and thermal conductivity of all metals and possesses the lowest contact resistance. It is stable in pure air and water, but tarnishes when exposed to ozone, hydrogen sulfide, or air containing sulfur. It is found in copper, copper-nickel, lead, and lead-zinc ores, among others. Silver was named after the Anglo-Saxon word "seolfor" or "siolfur," meaning 'silver'.

Tin Bohr ModelSee more Tin products. Tin (atomic symbol: Sn, atomic number: 50) is a Block P, Group 14, Period 5 element with an atomic weight of 118.710. The number of electrons in each of tin's shells is 2, 8, 18, 18, 4 and its electron configuration is [Kr] 4d10 5s2 5p2. The tin atom has a radius of 140.5 pm and a Van der Waals radius of 217 pm.In its elemental form, tin has a silvery-gray metallic appearance. It is malleable, ductile and highly crystalline. High Purity (99.9999%) Tin (Sn) MetalTin has nine stable isotopes and 18 unstable isotopes. Under 3.72 degrees Kelvin, Tin becomes a superconductor. Applications for tin include soldering, plating, and such alloys as pewter. The first uses of tin can be dated to the Bronze Age around 3000 BC in which tin and copper were combined to make the alloy bronze. The origin of the word tin comes from the Latin word Stannum which translates to the Anglo-Saxon word tin. For more information on tin, including properties, safety data, research, and American Elements' catalog of tin products, visit the Tin element page.

Recent Research

Synthesis and thermal behavior of tin-based alloy (Sn-Ag-Cu) nanoparticles., Roshanghias, Ali, Yakymovych Andriy, Bernardi Johannes, and Ipser Herbert , Nanoscale, 2015 Mar 19, Volume 7, Issue 13, p.5843-51, (2015)

Formation of an indium tin oxide nanodot/Ag nanowire electrode as a current spreader for near ultraviolet AlGaN-based light-emitting diodes., Park, Jae-Seong, Kim Jae-Ho, Kim Jun-Yong, Kim Dae-Hyun, Na Jin-Young, Kim Sun-Kyung, Kang Daesung, and Seong Tae-Yeon , Nanotechnology, 2017 Jan 27, Volume 28, Issue 4, p.045205, (2017)

A graded nano-TiN coating on biomedical Ti alloy: Low friction coefficient, good bonding and biocompatibility., Cui, Wenfang, Qin Gaowu, Duan Jingzhu, and Wang Huan , Mater Sci Eng C Mater Biol Appl, 2017 Feb 01, Volume 71, p.520-528, (2017)

Single-step preparation of indium tin oxide nanocrystals dispersed in ionic liquids via oxidation of molten In-Sn alloys., Sugioka, Daisuke, Kameyama Tatsuya, Yamamoto Takahisa, Kuwabata Susumu, and Torimoto Tsukasa , Chem Commun (Camb), 2016 Oct 6, Volume 52, Issue 82, p.12241-12244, (2016)

Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys., Yu, Xin-Ye, Xing Wen-Qing, and Ding Min , Ultrason Sonochem, 2016 Jul, Volume 31, p.216-21, (2016)

Reactive Sputter Deposition of WO3/Ag/WO3 Film for Indium Tin Oxide (ITO)-Free Electrochromic Devices., Yin, Yi, Lan Changyong, Guo Huayang, and Li Chun , ACS Appl Mater Interfaces, 2016 Feb 5, (2016)

Nanoscale precipitates strengthened lanthanum-bearing Mg-3Sn-1Mn alloys through continuous rheo-rolling., Guan, R G., Shen Y F., Zhao Z Y., and Misra R D. K. , Sci Rep, 2016, Volume 6, p.23154, (2016)

Interface Promoted Reversible Mg Insertion in Nanostructured Tin-Antimony Alloys., Cheng, Yingwen, Shao Yuyan, Parent Lucas R., Sushko Maria L., Li Guosheng, Sushko Peter V., Browning Nigel D., Wang Chongmin, and Liu Jun , Adv Mater, 2015 Sep 30, (2015)

[Study on the method for the determination of trace boron, molybdenum, silver, tin and lead in geochemical samples by direct current arc full spectrum direct reading atomic emission spectroscopy (DC-Arc-AES)]., Hao, Zhi-hong, Yao Jian-zhen, Tang Rui-ling, Zhang Xue-mei, Li Wen-ge, and Zhang Qin , Guang Pu Xue Yu Guang Pu Fen Xi, 2015 Feb, Volume 35, Issue 2, p.527-33, (2015)

Polyhedral Palladium-Silver Alloy Nanocrystals as Highly Active and Stable Electrocatalysts for the Formic Acid Oxidation Reaction., Fu, Geng-Tao, Liu Chang, Zhang Qi, Chen Yu, and Tang Ya-Wen , Sci Rep, 2015, Volume 5, p.13703, (2015)

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