Tris(triphenylphosphine)(trifluoromethyl)copper(I)

CAS #:

Linear Formula:

C55H45CuF3P3

MDL Number:

MFCD22200540

EC No.:

N/A

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
(2N) 99% Tris(triphenylphosphine)(trifluoromethyl)copper(I)
CU-OMX-05
Pricing > SDS > Data Sheet >
(3N) 99.9% Tris(triphenylphosphine)(trifluoromethyl)copper(I)
CU-OMX-04
Pricing > SDS > Data Sheet >
(4N) 99.99% Tris(triphenylphosphine)(trifluoromethyl)copper(I)
CU-OMX-03
Pricing > SDS > Data Sheet >
(5N) 99.999% Tris(triphenylphosphine)(trifluoromethyl)copper(I)
CU-OMX-02
Pricing > SDS > Data Sheet >

Tris(triphenylphosphine)(trifluoromethyl)copper(I) Properties (Theoretical)

Compound Formula C55H45CuF3P3
Molecular Weight 919.41
Appearance White crystals
Melting Point 155°C
Boiling Point N/A
Density N/A
Solubility in H2O N/A
Exact Mass 918.198218
Monoisotopic Mass 918.198218

Tris(triphenylphosphine)(trifluoromethyl)copper(I) Health & Safety Information

Signal Word Warning
Hazard Statements H315, H319
Hazard Codes N/A
Risk Codes 36/38
Safety Statements 26-36
RTECS Number N/A
Transport Information N/A
WGK Germany N/A
MSDS / SDS

About Tris(triphenylphosphine)(trifluoromethyl)copper(I)

Tris(triphenylphosphine)(trifluoromethyl)copper(I) is generally immediately available in most volumes, including bulk quantities. American Elements can produce most materials in high purity and ultra high purity (up to 99.99999%) forms and follows applicable ASTM testing standards; a range of grades are available including Mil Spec (military grade), ACS, Reagent and Technical Grade, Food, Agricultural and Pharmaceutical Grade, Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia). We can also produce materials to custom specifications by request, in addition to custom compositions for commercial and research applications and new proprietary technologies. Typical and custom packaging is available, as is additional research, technical and safety (MSDS) data.

Tris(triphenylphosphine)(trifluoromethyl)copper(I) Synonyms

(Trifluoromethyl)tris(triphenylphosphane)copper(I)

Chemical Identifiers

Linear Formula C55H45CuF3P3
MDL Number MFCD22200540
EC No. N/A
Beilstein/Reaxys No. N/A
Pubchem CID 12057354
IUPAC Name copper(1+); trifluoromethane; triphenylphosphane
SMILES C1=CC=C(C=C1)P(C2=CC=CC=C2)C3=CC=CC=C3.C1=CC=C(C=C1)P(C2=CC=CC=C2)C3=CC=CC=C3.C1=CC=C(C=C1)P(C2=CC=CC=C2)C3=CC=CC=C3.[C-](F)(F)F.[Cu+]
InchI Identifier InChI=1S/3C18H15P.CF3.Cu/c3*1-4-10-16(11-5-1)19(17-12-6-2-7-13-17)18-14-8-3-9-15-18;2-1(3)4;/h3*1-15H;;/q;;;-1;+1
InchI Key ADEZRALRKPUAPZ-UHFFFAOYSA-N

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

Copper

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper..

TODAY'S TOP DISCOVERY!

March 28, 2024
Los Angeles, CA
Each business day American Elements' scientists & engineers post their choice for the most exciting materials science news of the day
University of Michigan researchers develop new fabrication process for helical metal nanoparticles

University of Michigan researchers develop new fabrication process for helical metal nanoparticles