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Ultra Thin Silver Nanoscale Foil

CAS #: 7440-22-4
Linear Formula:
Ag
MDL Number
MFCD00003397
EC No.:
231-131-3

ORDER

Product Product Code ORDER SAFETY DATA Technical data
(3N) 99.9% Ultra Thin Silver Nanoscale Foil AG-M-03-FN SDS > Data Sheet >
(4N) 99.99% Ultra Thin Silver Nanoscale Foil AG-M-04-FN SDS > Data Sheet >
(5N) 99.999% Ultra Thin Silver Nanoscale Foil AG-M-05-FN SDS > Data Sheet >
WHOLESALE/SKU 0000-742-8619

Ultra Thin Silver Nanoscale Foil Properties (Theoretical)

Molecular Weight 107.87
Appearance Silver
Melting Point 961.78 °C
Boiling Point 2162 °C
Density 10490 kg/m3
Solubility in H2O N/A
Poisson's Ratio 0.37
Young's Modulus 83 GPa
Vickers Hardness 251 MPa
Tensile Strength N/A
Thermal Conductivity 4.29 W/cm/K @ 298.2 K
Thermal Expansion (25 °C) 18.9 µm·m-1·K-1
Electrical Resistivity 1.586 microhm-cm @ 20 °C
Electronegativity 1.9 Paulings
Specific Heat 0.0566 Cal/g/K @ 25 °C
Heat of Fusion 2.70 Cal/gm mole
Heat of Vaporization 60.7 K-Cal/gm atom at 2212 °C

Ultra Thin Silver Nanoscale Foil Health & Safety Information

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
Precautionary Statements P273-P391-P501a
Flash Point Not applicable
Risk Codes N/A
Safety Statements N/A
RTECS Number N/A
Transport Information NONH
WGK Germany 3

About Ultra Thin Silver Nanoscale Foil

American Elements’ Nanometal™, nanoscale foil manufacturing unit produces ultra thin foil as thin as only 50 nm thick in diameters up to 910 mm. Typically, foils are in thicknesses from 20 nm to 1000 nm, 1 micron, 2 micron, and up to a few microns thick. Nanometal™ ultra thin foil can also be produced on a substrate with a parting agent to permit removal by floating and can then be mounted on frames. Frames may be washers, rings, or more-complicated assemblies. Nanometal™ is one of the many ultra high purity metal forms available from American Elements for semiconductor and other electronic applications and for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) in specific applications such as fuel cells and solar energy. We also produce metallic nanopowders (see also Nanotechnology) and metals by crystallization for this purpose. For foils >1 micron thick see our Silver Foil page. We also produce Silver as rods, powder and plates. Other shapes are available by request.

Synonyms

N/A

Chemical Identifiers

Linear Formula Ag
Pubchem CID 23954
MDL Number MFCD00003397
EC No. 231-131-3
IUPAC Name silver
Beilstein/Reaxys No. N/A
SMILES [Ag]
InchI Identifier InChI=1S/Ag
InchI Key BQCADISMDOOEFD-UHFFFAOYSA-N
Chemical Formula
Molecular Weight
Standard InchI
Appearance
Melting Point
Boiling Point
Density

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Silver products. Silver (atomic symbol: Ag, atomic number: 47) is a Block D, Group 11, Period 5 element with an atomic weight of 107.8682. Silver Bohr ModelThe number of electrons in each of Silver's shells is 2, 8, 18, 18, 1 and its electron configuration is [Kr]4d10 5s1. The silver atom has a radius of 144 pm and a Van der Waals radius of 203 pm. Silver was first discovered by Early Man prior to 5000 BC. In its elemental form, silver has a brilliant white metallic luster. Elemental SilverIt is a little harder than gold and is very ductile and malleable, being exceeded only by gold and perhaps palladium. Pure silver has the highest electrical and thermal conductivity of all metals and possesses the lowest contact resistance. It is stable in pure air and water, but tarnishes when exposed to ozone, hydrogen sulfide, or air containing sulfur. It is found in copper, copper-nickel, lead, and lead-zinc ores, among others. Silver was named after the Anglo-Saxon word "seolfor" or "siolfur," meaning 'silver'.