Vanadium Copper Sputtering Target

Linear Formula:

V-Cu

MDL Number:

N/A

EC No.:

N/A

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
(2N) 99% Vanadium Copper Sputtering Target
V-CU-02-ST
Pricing > SDS > Data Sheet >
(2N5) 99.5% Vanadium Copper Sputtering Target
V-CU-025-ST
Pricing > SDS > Data Sheet >
(3N) 99.9% Vanadium Copper Sputtering Target
V-CU-03-ST
Pricing > SDS > Data Sheet >
(3N5) 99.95% Vanadium Copper Sputtering Target
V-CU-035-ST
Pricing > SDS > Data Sheet >
(4N) 99.99% Vanadium Copper Sputtering Target
V-CU-04-ST
Pricing > SDS > Data Sheet >
(5N) 99.999% Vanadium Copper Sputtering Target
V-CU-05-ST
Pricing > SDS > Data Sheet >

Vanadium Copper Sputtering Target Properties (Theoretical)

Compound Formula CuV
Appearance Metallic target
Melting Point N/A
Boiling Point N/A
Density N/A
Solubility in H2O N/A
Monoisotopic Mass 113.874 g/mol

Vanadium Copper Sputtering Target Health & Safety Information

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
RTECS Number N/A
Transport Information N/A
MSDS / SDS

About Vanadium Copper Sputtering Target

American Elements specializes in producing high purity Vanadium Copper Sputtering Targets with the highest possible density High Purity (99.99%) Metallic Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. We offer all shapes and configurations of targets compatible with all standard guns including circular, rectangular, annular, oval, "dog-bone," rotatable (rotary), multi-tiled and others in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce Vanadium as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.

Vanadium Copper Sputtering Target Synonyms

Copper-Vanadium (CuV) Master Alloy, CuV1, Cu:V 99:1, VCu

Chemical Identifiers

Linear Formula V-Cu
MDL Number N/A
EC No. N/A
Pubchem CID 18175929
IUPAC Name copper(1+); vanadium(2+)
SMILES [V+2].[Cu+]
InchI Identifier InChI=1S/Cu.V/q+1;+2
InchI Key BFEQNQZKCPDLMZ-UHFFFAOYSA-N

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper.

See more Vanadium products. Vanadium (atomic symbol: V, atomic number: 23) is a Block D, Group 5, Period 4 element with an atomic weight of 50.9415. Vanadium Bohr ModelThe number of electrons in each of Vanadium's shells is 2, 8, 11, 2 and its electron configuration is [Ar] 3d3 4s2. The vanadium atom has a radius of 134 pm and a Van der Waals radius of 179 pm. Vanadium was discovered by Andres Manuel del Rio in 1801 and first isolated by Nils Gabriel Sefström in 1830. In its elemental form, vanadium has a bluish-silver appearance. Elemental VanadiumIt is a hard, ductile transition metal that is primarily used as a steel additive and in alloys such as Titanium-6AL-4V, which is composed of titanium, aluminum, and vanadium and is the most common titanium alloy commercially produced. Vanadium is found in fossil fuel deposits and 65 different minerals. Vanadium is not found free in nature; however, once isolated it forms an oxide layer that stabilizes the free metal against further oxidation. Vanadium was named after the word "Vanadis" meaning goddess of beauty in Scandinavian mythology.

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