Nanofluidic Chip for Liquid TEM Cell Fabricated by Parylene and Silicon Nitride Direct Bonding.

Title Nanofluidic Chip for Liquid TEM Cell Fabricated by Parylene and Silicon Nitride Direct Bonding.
Authors H. Jang; I.S. Kang; J. Kim; J. Kim; Y.Jeong Cha; D.Ki Yoon; W. Lee
Journal Nanotechnology
DOI 10.1088/1361-6528/aa8196
Abstract

Despite the importance of nanofluidic TEM chips, a simple fabrication method has yet to be developed due to the difficulty of wafer bonding techniques using a nanoscale thick bonding layer. We present a simple and robust wafer scale bonding technique using parylene as a bonding layer. A nanoscale thick parylene layer was deposited on a SiN wafer and patterned to construct nanofluidic channels. The patterned parylene layer was directly bonded to another SiN wafer by thermal surface activation and bonding, with a bonding strength of ~3 MPa. Fourier transform infrared spectroscopy showed that carbon-oxygen bonds were generated by thermal activation. We demonstrated TEM imaging of gold nanoparticles suspended in liquid using the fabricated nanofluidic chip.

Citation H. Jang; I.S. Kang; J. Kim; J. Kim; Y.Jeong Cha; D.Ki Yoon; W. Lee.Nanofluidic Chip for Liquid TEM Cell Fabricated by Parylene and Silicon Nitride Direct Bonding.. Nanotechnology. 2017. doi:10.1088/1361-6528/aa8196

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