Electronics Materials
Types of Materials for Electronics Applications
High Purity Materials
American Elements specializes in providing advanced materials that meet the high purity demands of microelectronics manufacturing processes. We can provide a wide variety of metals and compounds to industry-leading levels of absolute purity, with most materials available in purities up to 6N (99.9999%), and several materials—such as elemental mercury used for the production of monocrystals and epitaxy layers--routinely produced to even higher purities, up to 9N.
For more information about American Elements’ material purification capabilities, please see our High Purity Materials page.
Deposition Materials
Thin film deposition techniques including sputtering, molecular beam epitaxy (MBE), electroplating, metal organic chemical vapor deposition (MOCVD), and atomic layer deposition (ALD), are absolutely essential to modern electronics manufacturing. American Elements understands the unique demands of each of these techniques, and can provide materials tailored to the exact demands of your process.
Sputtering Targets
Many materials used in semiconductor devices can be deposited using sputtering methods, including interconnect metal layers, transparent conductive oxides, phase change materials, barrier metals, and protective coatings. American Elements’ sputtering targets are engineered with the highest possible density and smallest possible average grain sizes, and can be produced from ultra high purity materials. For more information, see our sputtering targets page.
MBE Ingots and Other Evaporation Materials
Molecular beam epitaxy is one of only a few available methods for the deposition of single crystals. It is frequently used in electronics manufacturing to produce thin films of compound semiconductors such as gallium arsenide or indium phosphide. MBE-grade (6N+) ingots of a variety of elements used in electronics fabrication, including antimony, arsenic, gallium, indium, magnesium, manganese, phosphorus, aluminum, beryllium, selenium, and tellurium, are available, and can be provided in custom-made sizes for specific MBE machines upon request. Many of these materials are extremely sensitive to oxygen or moisture, and as such are prepared with special care, including packaging under a vacuum.
Evaporative materials for other physical vapor deposition techniques are also available in a variety of shapes and sizes. For more information, see our evaporation materials page.
Electroplating Solutions
Electroplating is another method of depositing thin layers of metals. It is often used in the plating of connectors, as well as to produce a variety of functional or decorative/protective metal layers. American Elements supplies solutions made to customer specifications for use in electroplating.
American Elements maintains solution production facilities in United States, Northern Europe (Liverpool, UK), Southern Europe (Milan, Italy), Australia and China to allow for lower freight costs and quicker delivery to our customers worldwide.
CVD Precursors
Metal organic chemical vapor deposition (MOCVD) is frequently used for the deposition of both single or polycrystalline semiconductor thin films, as well as several pure metals (most notably aluminum), from organic precursors. American Elements provides a wide variety of organometallic and organosilicon compounds used in MOCVD.
Additionally, a number of important pure metals and metal silicides used in electronics are deposited from non-organometallic precursors. These include:
- Tungsten/tungsten silicide – deposited from tungsten hexafluoride
- Molybdenum/molybdenum disilicide– deposited from molybdenum pentachloride
- Tantalum – deposited from tantalum pentachloride
- Titanium/titanium disilicide – deposited from titanium pentachloride
ALD Precursors
Atomic layer deposition is a thin film deposition technique that provides an extreme degree of control over the films produces, as the film is produced a single layer of atoms at a time. In electronics manufacturing it can be used to deposit high-k gate oxides and capacitor dielectrics, ferroelectric compounds, metal nitrides, protective or passivating coatings, anti-reflection coatings, insulating layers, and gate and barrier metals. Precursors for ALD include metal oxides, fluorides, and nitrides, as well as some organometallics. Some ALD processes additionally require the use of catalyst metals that are not themselves deposited.
Bulk Optical and Semiconductor Materials
Bulk Crystalline Materials
American Elements produces a variety of single crystal and polycrystalline materials for use in electronics device fabrication. Crystalline materials can be provided in the form of substrates, sputtering targets, ingots, discs, shaped charges, rods, and windows. Our crystals are grown from ultra high purity precursors in a production facility capable of a variety of established crystal growth technologies, and we frequently produce pilot scale lots or custom variations on request.
Additional materials can be found on our optical materials and semiconductors pages.
Fused Quartz
Fused quartz, a glass made of pure silica, finds use in electronics manufacturing as the substrate material typically used for photolithography photomasks. Additionally, fused quartz windows are frequently components of electronics products. Fused quartz is available in a variety of sizes and forms, including sheets, rods, and sputtering targets.
High Purity Rare Earth Elements & Compounds
Rare earth elements, in pure form and as compounds, are frequently used in electronics devices, most often as dopants or in phosphors. Powerful, compact are earth magnets are particularly important for hard disk drives (HDD), optical pickups, magnetic circuits, and other electronic and magneto-optical components. We produce high purity (3N, 4N, 5N, and 6N) rare earth metals, oxides, fluorides, chlorides, and other compounds in numerous shapes and sizes down to nanoscale. Materials of particular interest for electronics manufacturing include
Processing Chemicals
A range of high purity chemicals are used in the fabrication and processing of electronic components, including photoresists, bulk and specialty gases, wet chemicals, organic solvents, etchants, and CMP slurries. These materials play important roles at all stages of integrated circuit and silicon chip fabrication, from CVD and wafer polishing to chip packaging. Bulk gases are typically atmospheric gases like oxygen and nitrogen, as opposed to specialty gases used as dopants and etchants. Common dopant and etchant gases include arsine and other gaseous hydrides, boron trichloride, boron trifluoride, silicon trichloride, and silicon trifluoride.
Electrical Interconnect Materials
Eutectic and Soft Solders
American Elements produces a variety of high purity, electronic grade metals and alloys suitable for finishing steps in integrated circuit production such as die-attach, reflow and wave soldering, wafer bumping, and package-on-package assembly. We manufacture pure metals, standard tin-lead alloys, specialty alloys, and a range of lead-free alloys as foils, ribbons, solder and bonding wires, pastes and fluxes, bars, and preforms; shapes can also be produced to customer specifications. Tin and lead containing materials can be provided in low-alpha emitter forms if required.
The melting temperatures of solder materials vary widely depending on composition, thus the choice of a particular material shold be based on its intended application. High temperature solder or brazing alloys melt above 270°C and are typically primarily gold -based: pure gold, gold-tin (AuSn), gold-germanium (AuGe), and gold-silicon. Tin-Silver-Copper
Low Alpha Materials
As semiconductor devices have grown ever more sophisticated, they have also become more sensitive to specific types of environmental damage. In recent years, the low level of radioactivity emitted by some forms of tin and lead traditionally processed for use in electronics manufacturing has been shown to impact device performance. Therefore many manufacturers have begun to seek out refined versions of these materials that exhibit reduced alpha emissions, and American Elements has responded to this demand.
Bonding Wires and Ribbons
American Elements manufactures high purity, corrosion-resistant wires in various dimensions for ball bonding and wedge bonding in IC and optoelectronic packaging. Gold bondwires are utilized in ball bonding and thermosonic bonding, for example; other typical products include aluminum bondwires, silver bondwires, and copper bondwires. Precious and non-precious metal ribbons are also available for applications requiring larger surface area connections. Wedge materials include tungsten carbide, titanium carbide, or other ceramics.
Below is only a limited selection of the full catalog of Electronics products that American Elements manufactures. If you do not see a material you're looking for listed, please search the website or contact customerservice@americanelements.com.
Sputtering Targets
- Aluminum Copper Silicon Sputtering Target
- Aluminum Copper Sputtering Target
- Aluminum Niobium Tantalum Sputtering Target
- Aluminum Rotatable Sputtering Target
- Aluminum Silicon Copper Sputtering Target
- Aluminum Silicon Sputtering Target
- Aluminum Silver Sputtering Target
- Aluminum Sputtering Target
- Aluminum Tantalum Sputtering Target
- Copper Aluminum Sputtering Target
- Copper Nickel Sputtering Target
- Copper Rotatable Sputtering Target
- Copper Sputtering Target
- Germanium Rotatable Sputtering Target
- Germanium Sputtering Target
- Gold Antimony Sputtering Target
- Gold Arsenic Sputtering Target
- Gold Copper Sputtering Target
- Gold Germanium Sputtering Target
- Gold Palladium Sputtering Target
- Gold Platinum Sputtering Target
- Gold Rotatable Sputtering Target
- Gold Sputtering Target
- Gold Tin Sputtering Target
- Indium Tin Oxide (ITO) Sputtering Target
- Iridium Rotatable Sputtering Target
- Iridium Rotatable Sputtering Target
- Iridium Sputtering Target
- Iridium Sputtering Target
- Nickel Copper Sputtering Target
- Nickel Iron Sputtering Target
- Nickel Platinum Sputtering Target
- Nickel Titanium Sputtering Target
- Nickel Vanadium Sputtering Target
- Niobium Rotatable Sputtering Target
- Niobium Sputtering Target
- Platinum Palladium Sputtering Target
- Platinum Rotatable Sputtering Target
- Platinum Sputtering Target
- Rhodium Rotatable Sputtering Target
- Rhodium Sputtering Target
- Ruthenium Rotatable Sputtering Target
- Ruthenium Sputtering Target
- Silicon Aluminum Rotatable Sputtering Target
- Silicon Rotatable Sputtering Target
- Silicon Sputtering Target
- Silver Aluminum Sputtering Target
- Silver Copper Sputtering Target
- Silver Fluoride Sputtering Target
- Silver Rotatable Sputtering Target
- Silver Sputtering Target
- Silver Tin Sputtering Target
- Tantalum Aluminum Sputtering Target
- Tantalum Rotatable Sputtering Target
- Tantalum Silicide Sputtering Target
- Tantalum Sputtering Target
- Tin Rotatable Sputtering Target
- Tin Sputtering Target
- Titanium Rotatable Sputtering Target
- Titanium Sputtering Target
Wafers & Substrates
- Ultra High Purity Silicon Wafer
- Gold-Coated Silicon Wafer
- Aluminum Nitride Wafer
- Aluminum Oxide Single Crystal Substrate
- Boron Nitride Single Crystal Substrate
- Gallium Antimonide Single Crystal Substrate
- Gallium Antimonide Wafer
- Gallium Arsenide Single Crystal Substrate
- Gallium Arsenide Wafer
- Gallium Nitride Wafer
- Gallium Phosphide Single Crystal Substrate
- Germanium Wafer
- Gold Wafer
- Indium Arsenide Wafer
- Indium Phosphide Wafer
- Indium Wafer
- Lanthanum Aluminum Oxide Single Crystal Substrate
- Lithium Niobate Wafer
- Lithium Tantalate Wafer
- LSAT Single Crystal Substrate
- Magnesium Aluminate Single Crystal Substrate
- Magnesium Oxide Single Crystal Substrate
- Magnesium Oxide Wafer
- Molybdenum Copper Wafers
- Sapphire Wafer
- Sapphire Windows
- Silicon Carbide Wafer
- Silicon Oxide Wafer
- Strontium Titanate Single Crystal Substrate
- Titanium Oxide, Rutile Single Crystal Substrate
- Zinc Selenide Windows
- Zinc Sulfide Windows
Alloys
- Aluminium Tin Copper Alloy Particles
- Aluminum Alloy 6061
- Aluminum Copper Alloy
- Aluminum Copper Silicon Alloy
- Aluminum Nickel Copper Magnesium Alloy
- Aluminum Niobium Tantalum Alloy
- Aluminum Silicon Alloy
- Aluminum Silicon Foil
- Aluminum Silicon Slug
- Aluminum Tin Copper Alloy
- Bismuth Indium Lead Tin Alloy BiInPbSn
- Bismuth Indium Tin Alloy BiInSn
- Bismuth Lead Cadmium Tin Alloy BiPbCdSn
- Bismuth Lead Indium Tin Alloy BiPbInSn
- Bismuth Lead Tin Alloy BiPbSn
- Bismuth Lead Tin Cadmium Alloy BiPbSnCd
- Bismuth Lead Tin Indium Alloy BiPbSnIn
- Bismuth Lead Tin Silver Alloy BiPbSnAg
- Bismuth Tin Alloy BiSn
- Bismuth Tin Cadmium Alloy BiSnCd
- Bismuth Tin Indium Lead Alloy BiSnInPb
- Bismuth Tin Silver Alloy BiSnAg
- Cadmium Zinc Alloy
- Copper Aluminum Foam
- Copper Aluminum Honeycomb
- Copper Aluminum Sponge
- Copper Aluminum Wool
- Copper Aluminum Zinc Alloy
- Copper Beryllium Foil
- Copper Gold Alloy
- Copper Gold Nickel Alloy
- Copper Nickel
- Copper Nickel Foil
- Copper Nickel Zinc Alloy
- Copper Tin Alloy Spherical Powder
- Copper Tin Silver Alloy CuSnAg
- Copper Zinc Silver Alloy
- Germanium Gold Metal
- Gold Antimony
- Gold Copper Alloy
- Gold Copper Nickel Alloy
- Gold Germanium Eutectic Foil
- Gold Germanium Pellets
- Gold Nickel Foil
- Gold Palladium Sputtering Target
- Gold Palladium Wire
- Gold Platinum Palladium Silver Indium
- Gold Silver Copper Alloy
- Gold Silver Copper Alloy Particles
- Gold Silver Copper Alloy Powder
- Gold Silver Tin Alloy AuAgSn
- Gold Tin Alloy AuSn
- Gold Tin Foil
- Gold Tin Pellets
- Gold/Palladium Foil
- Gold/Palladium Tube
- Gold/Platinum/Palladium Powder
- Indium Bismuth Alloy InBi
- Indium Bismuth Cadmium Alloy InBiCd
- Indium Bismuth Tin Alloy InBiSn
- Indium Cadmium Alloy InCd
- Indium Lead Alloy InPb
- Indium Lead Silver Alloy InPbAg
- Indium Silver Alloy InAg
- Indium Tin Alloy InSn
- Indium Tin Cadmium Alloy InSnCd
- Indium Tin Lead Alloy InSnPb
- Indium Tin Lead Cadmium Alloy InSnPbCd
- Lead Antimony Tin Alloy PbSbSn
- Lead Bismuth Tin Cadmium Alloy PbBiSnCd
- Lead Indium Alloy PbIn
- Lead Indium Antimony Alloy PbInSb
- Lead Indium Silver Alloy PbInAg
- Lead Silver Tin Alloy PbAgSn
- Lead Tin Alloy PbSn
- Lead Tin Silver Alloy PbSnAg
- Lead Tin Silver Antimony Alloy PbSnAgSb
- Lead Tin Silver Indium Alloy PbSnAgIn
- Nickel Copper Silicon Alloy
- Nickel Platinum Alloy
- Nickel Silver Foil
- Nickel Silver Tube
- Palladium Copper Foil
- Palladium Silver Foil
- Palladium Silver Silicon Alloy
- Palladium Sputtering Target
- Platinum Gold Paste
- Platinum Iridium Alloy
- Platinum Iridium Foil
- Platinum Iridium Tube
- Platinum Iridium Wire
- Platinum Palladium Gold Alloy
- Platinum Palladium Gold Paste
- Platinum Palladium Sputtering Target
- Silicon Germanium Alloy
- Silicon Nickel Alloy
- Silver Cadmium Zinc Copper
- Silver Cadmium Zinc Copper Alloy Particles
- Silver Copper Alloy Particles
- Silver Copper Alloy Powder
- Silver Copper Foil
- Silver Copper Nickel Alloy
- Silver Copper Tin Alloy
- Silver Copper Tin Nickel Alloy
- Silver Copper Wire
- Silver Copper Zinc Alloy
- Silver Copper Zinc Tin Alloy
- Silver Gold Alloy
- Silver Gold Hollow Spheres
- Silver Gold Tube
- Silver Nickel
- Silver Palladium Foil
- Silver Silicon Alloy
- Silver Tungsten Electrode
- Silver/Copper Eutectic Brazing Paste
- Silver/Palladium/Platinum Conductor Paste
- Silver/Platinum Conductor Paste
- Tantalum Aluminum Alloy
- Tantalum Zirconium Alloy
- Tin Antimony Alloy Sn-Sb
- Tin Antimony Gold Alloy Sn-Sb-Au
- Tin Bismuth Alloy Powder Sn-Bi
- Tin Bismuth Copper Silver Alloy
- Tin Bismuth Silver Alloy Sn-Bi-Ag
- Tin Bismuth Zinc Alloy Sn-Bi-Zn
- Tin Cadmium Alloy Sn-Cd
- Tin Copper Alloy
- Tin Gold Alloy
- Tin Indium Alloy Sn-In
- Tin Indium Silver Alloy Sn-In-Ag
- Tin Indium Silver Bismuth Alloy
- Tin Lead Alloy Sn-Pb
- Tin Lead Antimony Alloy Sn-Pb-Sb
- Tin Lead Cadmium Alloy Sn-Pb-Cd
- Tin Lead Indium Alloy Sn-Pb-In
- Tin Lead Silver Alloy Sn-Pb-Ag
- Tin Silver Alloy
- Tin Silver Antimony Alloy Sn-Ag-Sb
- Tin Silver Bismuth Copper Alloy Sn-Ag-Bi-Cu
- Tin Silver Copper Alloy Sn-Ag-Cu
- Tin Silver Zinc Alloy Sn-Ag-Zn
- Tin Zinc Alloy Sn-Zn
- Tinned Copper Foil
- Tinned Copper Wire
- Titanium Palladium Alloy
- Titanium Palladium Foil
- Titanium Platinum Alloy
- Titanium Tantalum Alloy
- Tungsten Copper Alloy
- Tungsten Silver Alloy
- Zirconium Silver Alloy
Electronics Grade Chemicals
- (3-Aminopropyl)triethoxysilane
- Ammonium Fluoride
- Ammonium Hydroxide Solution
- Arsenic(III) Chloride
- Barium Tetrafluorocobaltate
- Beryllium Chloride
- Beryllium Fluoride
- Bis(cyclopentadienyl)ruthenium(II)
- Bis(ethylenediamine)copper(II) Hydroxide
- Boron Trifluoride-Methanol Solution
- Dichlorotetrakis(pyridine)iron
- Germanium(IV) Fluoride
- Hafnium Dimethylamide
- Hafnium(IV) n-butoxide
- Lead(II) Salicylate
- Molybdenumhexacarbonyl
- Phosphorus Oxychloride
- Phosphorus Pentasulfide
- Phosphorus Triiodide
- Platinum Acetylacetonate
- Potassium Hydroxide
- Potassium Hydroxide Pellets
- Rhodium Acetylacetonate
- Selenium Tetrachloride
- Silicon Tetrachloride
- Sodium Dodecyl Sulfate
- Sodium Hydroxide
- Sodium Hydroxide Pellets
- Tetraethyl orthosilicate
- trans-Dichlorobis(ethylenediamine)cobalt(III) Chloride
- Trimethyl(methylcyclopentadienyl)platinum(IV)
- Trimethylaluminum
- Trimethylgallium
- Trimethylindium
- Tungsten(VI) Fluoride
- Zinc Fluoride
- Zirconium Butoxide Solution
- Zirconium-2-Methyl-2-butoxide
Optical Coatings
- Aluminum Fluoride
- Aluminum Metal
- Aluminum Oxide
- Cadmium Telluride
- Calcium Fluoride
- Cerium Fluoride
- Chromium
- Chromium Oxide
- Germanium
- Gold Metal
- Hafnium Dioxide
- Indium Oxide
- Indium Tin Oxide
- Lanthanum Fluoride
- Lead Telluride
- Magnesium Fluoride
- Niobium Pentoxide
- Praseodymium Oxide
- Scandium Oxide
- Silicon
- Silicon Dioxide
- Silicon Monoxide
- Silicon Oxide - Aluminum Oxide
- Silver Metal
- Tantalum Pentoxide
- Yttrium Fluoride
- Yttrium Oxide
- Zinc Selenide
- Zinc Sulfide
- Zirconium Oxide
- Zirconium Oxide - Aluminum Oxide
- Zirconium Oxide - Tantalum Oxide
- Zirconium Oxide - Titanium Oxide
Inks & Pastes
- Aluminum-doped Zinc Oxide Nanoparticle Ink
- Aluminum Ink
- Aluminum Oxide Paste
- Aluminum Paste
- Carbon Graphite Ink
- Carbon Nanotube Ink
- Copper Conductor Paste
- Copper Ink
- Copper Oxide Nanoparticle Ink
- Gold Conductor Paste
- Gold Ink
- Graphene Ink
- Graphite Paste
- Nickel Ink
- Nickel Paste
- Palladium Conductor Paste
- Palladium Ink
- Palladium Conductor Paste
- Platinum/Gold Conductor Paste
- Platinum Ink
- Platinum/Palladium/Gold Conductor Paste
- Silver Carbon Paste
- Silver Chloride Ink
- Silver-Coated Copper Ink
- Silver/Copper Paste
- Silver Ink
- Silver Nanoparticle Ink
- Silver/Palladium Conductor Paste
- Silver Palladium Ink
- Silver/Palladium/Platinum Conductor Paste
- Silver Paste
- Silver/Platinum Conductor Paste
- Tantalum Capacitor Paste
- Tungsten Conductor Paste
- Tungsten Oxide Nanoparticle Ink
- Zinc Oxide Nanoparticle Ink
Pure Metals
- Aluminum Foil
- Aluminum Ingot
- Aluminum Insulated Wire
- Aluminum Paste
- Aluminum Powder
- Aluminum Ribbon
- Aluminum Slugs
- Aluminum Strip
- Aluminum Tape
- Aluminum Tube
- Aluminum Wire
- Cobalt Foil
- Cobalt Ingot
- Cobalt Metal
- Cobalt Powder
- Cobalt Ribbon
- Cobalt Slugs
- Cobalt Strip
- Cobalt Tape
- Cobalt Tube
- Cobalt Wire
- Copper Busbars
- Copper Conductor Paste
- Copper Foil
- Copper Ingot
- Copper Insulated Wire
- Copper Metal
- Copper Ribbon
- Copper Single Crystal
- Copper Slugs
- Copper Spheres
- Copper Strip
- Copper Tape
- Copper Tube
- Copper Wire
- Gold (By Crystallization)
- Gold Foil
- Gold Ingot
- Gold Insulated Wire
- Gold Paste
- Gold Paste
- Gold Powder
- Gold Ribbon
- Gold Slugs
- Gold Spheres
- Gold Strip
- Gold Tape
- Gold Tubes
- Gold Wire
- Iridium Foil
- Iridium Ingot
- Iridium Metal
- Iridium Powder
- Iridium Ribbon
- Iridium Slugs
- Iridium Strip
- Iridium Tape
- Iridium Tube
- Iridium Wire
- Nickel Foil
- Nickel Ingot
- Nickel Insulated Wire
- Nickel Insulated Wire
- Nickel Metal
- Nickel Nanocrystalline Foil
- Nickel Powder
- Nickel Ribbon
- Nickel Slugs
- Nickel Strip
- Nickel Tape
- Nickel Tube
- Nickel Wire
- Niobium Foil
- Niobium Ingot
- Niobium Insulated Wire
- Niobium Metal
- Niobium Powder
- Niobium Ribbon
- Niobium Slugs
- Niobium Spheres
- Niobium Strip
- Niobium Tape
- Niobium Tube
- Niobium Wire
- Palladium Foil
- Palladium Ingot
- Palladium Metal
- Palladium Paste
- Palladium Powder
- Palladium Ribbon
- Palladium Slugs
- Palladium Strip
- Palladium Tape
- Palladium Tubes
- Palladium Wire
- Platinum Foil
- Platinum Ingot
- Platinum Insulated Wire
- Platinum Metal
- Platinum Paste
- Platinum Powder
- Platinum Ribbon
- Platinum Slugs
- Platinum Strip
- Platinum Tape
- Platinum Tube
- Platinum Wire
- Silver Wire
- Silver Foil
- Silver Ingot
- Silver Insulated Wire
- Silver Paste
- Silver Powder
- Silver Ribbon
- Silver Slugs
- Silver Strip
- Silver Tape
- Silver Tube
- Silver Wire
- Tantalum Foil
- Tantalum Ingot
- Tantalum Metal
- Tantalum Powder
- Tantalum Ribbon
- Tantalum Slugs
- Tantalum Spheres
- Tantalum Strip
- Tantalum Tape
- Tantalum Tube
- Tantalum Wire
- Titanium Foil
- Titanium Ingot
- Titanium Metal
- Titanium Powder
- Titanium Ribbon
- Titanium Slugs
- Titanium Sponge
- Titanium Strip
- Titanium Tape
- Titanium Tube
- Titanium Wire
- Tungsten Foil
- Tungsten Ingot
- Tungsten Metal
- Tungsten Paste
- Tungsten Powder
- Tungsten Ribbon
- Tungsten Slugs
- Tungsten Strip
- Tungsten Tape
- Tungsten Tube
- Tungsten Wire
American Elements supplies a comprehensive range of materials to the consumer and automotive electronics industries for all stages of production. Materials include deposition materials, optical and semiconductor materials, rare earth elements and compounds, nanostructured materials, and ultra high purity/MBE-grade metals, alloys, and compounds. We can provide raw, refined, and precursor forms of almost any material used in electronics manufacturing, including dielectrics (including specialized high-k and low-k materials), metals, semiconductors, transparent conductive oxides, and protective coatings. We manufacture materials are suitable for microelectronics assemblies, thermal management, soldering and wire bonding, contacts and electrical interconnects, sensors, precious metal thermocouples, flip chip metallization, and packaging.
With years of experience meeting the needs of electronics manufacturers and designers, American Elements is sensitive to the special concerns unique to this industry. Our ISO 9001 certified production facilities guarantee high quality materials with minimal oxide impurities and lot-to-lot consistency.