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Copper Sputtering Target

CAS #: 7440-50-8
Linear Formula:
Cu
MDL Number
MFCD00010965
EC No.:
231-159-6

ORDER

Product Product Code ORDER SAFETY DATA Technical data
(2N) 99% Copper Sputtering Target CU-M-02-ST SDS > Data Sheet >
(2N5) 99.5% Copper Sputtering Target CU-M-025-ST SDS > Data Sheet >
(3N) 99.9% Copper Sputtering Target CU-M-03-ST SDS > Data Sheet >
(3N5) 99.95% Copper Sputtering Target CU-M-035-ST SDS > Data Sheet >
(4N) 99.99% Copper Sputtering Target CU-M-04-ST SDS > Data Sheet >
(5N) 99.999% Copper Sputtering Target CU-M-05-ST SDS > Data Sheet >
(6N) 99.9999% Copper Sputtering Target CU-M-06-ST SDS > Data Sheet >
(2N) 99% Copper Rotatable Sputtering Target CU-M-02-STR SDS > Data Sheet >
(2N5) 99.5% Copper Rotatable Sputtering Target CU-M-025-STR SDS > Data Sheet >
(3N) 99.9% Copper Rotatable Sputtering Target CU-M-03-STR SDS > Data Sheet >
(3N5) 99.95% Copper Rotatable Sputtering Target CU-M-035-STR SDS > Data Sheet >
(4N) 99.99% Copper Rotatable Sputtering Target CU-M-04-STR SDS > Data Sheet >
(5N) 99.999% Copper Rotatable Sputtering Target CU-M-05-STR SDS > Data Sheet >
WHOLESALE/SKU 0000-742-{{nid}}

Copper Sputtering Target Properties (Theoretical)

Molecular Weight 63.55
Appearance Reddish Metal
Melting Point 1085°C
Boiling Point 2562°C
Density 8.96 g/cm3
Solubility in H2O N/A
Poisson's Ratio 0.34
Young's Modulus 110–128 GPa
Vickers Hardness 369 MPa
Thermal Conductivity 401 W·m-1·K-1
Thermal Expansion (25 °C) 16.5 µm·m-1·K-1
Electrical Resistivity 1.673 μΩ-cm @ 20°C
Electronegativity 1.90 Paulings
Specific Heat 0.39 kJ/kg K
Heat of Fusion 13.26 kJ·mol-1
Heat of Vaporization 300.4 kJ·mol-1

Copper Sputtering Target Health & Safety Information

Signal Word Danger
Hazard Statements H228-H400
Hazard Codes F
Risk Codes 11
Safety Statements 16
RTECS Number GL5325000
Transport Information UN 3089 4.1/PG 2
WGK Germany 3

About Copper Sputtering Target

American Elements specializes in producing high purity Copper sputtering targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. High Purity (99.9999%) Copper (Cu) Sputtering Target We offer all shapes and configurations of targets compatible with all standard guns including circular, rectangular, annular, oval, "dog-bone," rotatable (rotary), multi-tiled and others in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce Copper as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.

Synonyms

Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper

Chemical Identifiers

Linear Formula Cu
Pubchem CID 23978
MDL Number MFCD00010965
EC No. 231-159-6
Beilstein/Reaxys No. N/A
SMILES [Cu]
InchI Identifier InChI=1S/Cu
InchI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Chemical Formula
Molecular Weight
Standard InchI
Appearance
Melting Point
Boiling Point
Density

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper.