Copper Spheres



Request Quote

Product Code Available Product Forms Request A Quote
CU-M-02-SPH (2N) 99% Copper Spheres Request
CU-M-03-SPH (3N) 99.9% Copper Spheres Request
CU-M-04-SPH (4N) 99.99% Copper Spheres Request
CU-M-05-SPH (5N) 99.999% Copper Spheres Request
CU-M-06-SPH (6N) 99.9999% Copper Spheres Request


Molecular Weight 63.55
Appearance Reddish Metal
Melting Point 1085 °C
Boiling Point 2562 °C
Density 8.96 g/cm3
Thermal Conductivity 401 W ·m-1 ·K-1
Electronegativity 1.90 Paulings
Specific Heat 0.39 kJ/kg K
Heat of Vaporization 300.4 kJ ·mol-1
Heat of Fusion 13.26 kJ ·mol-1

Health & Safety Info  |  MSDS / SDS

Signal Word Danger
Hazard Statements H228-H400
Hazard Codes F
Risk Codes 11
Safety Statements 16
RTECS Number GL5325000
Transport Information UN 3089 4.1/PG 2
WGK Germany 3
Globally Harmonized System of Classification and Labelling (GHS) N/A


American Elements specializes in producing high purity uniform shaped Copper Spheres with the highest possible density High Purity Sphereand smallest possible average grain sizes for use in semiconductor, Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Our standard Slug sizes range from 1/8" x 1/8" to 1/4" x 1/4" and 3 mm diameter. We can also provide Sphere outside this range for ultra high purity thin film applications, such as fuel cells and solar energy layers. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes nanoparticles. We also produce Copper as rod, ingot, powder, pieces, disc, granules, wire, and in compound forms, such as oxide. Other shapes are available by request.



Chemical Identifiers

Formula Cu
CAS 7440-50-8
Pubchem CID 23978
MDL MFCD00010965
EC No. 231-159-6
Beilstein Registry No. N/A
InchI Identifier InChI=1S/Cu

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Material Safety Data Sheet (MSDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes.

Related Products & Element Information

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a red-orange metallic luster appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity.The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus." Cyprus, a Mediterranean island, was known as an ancient source of mined copper.