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Silver Copper Tin Alloy

Linear Formula:

Ag-Cu-Sn

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
Ag-60% Cu-30% Sn-10%
AG-CU-01-P.010SN
Pricing > SDS > Data Sheet >

Properties

Appearance

Solid

Health & Safety Info  |  MSDS / SDS

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
Transport Information N/A
MSDS / SDS

About

Silver Copper Tin is one of numerous metal alloys sold by American Elements under the trade name AE Alloys™. Generally immediately available in most volumes, AE Alloys™ are available as bar, ingot, ribbon, wire, shot, sheet, and foil. Ultra high purity and high purity forms also include metal powder, submicron powder and nanoscale, targets for thin film deposition, and pellets for chemical vapor deposition (CVD) and physical vapor deposition (PVD) applications. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Primary applications include bearing assembly, ballast, casting, step soldering, and radiation shielding.

Synonyms

Silver-copper-tin, AgCuSn

Chemical Identifiers

Linear Formula

Ag-Cu-Sn

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a red-orange metallic luster appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity.The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus." Cyprus, a Mediterranean island, was known as an ancient source of mined copper.

See more Silver products. Silver (atomic symbol: Ag, atomic number: 47) is a Block D, Group 11, Period 5 element with an atomic weight of 107.8682. Silver Bohr ModelThe number of electrons in each of Silver's shells is 2, 8, 18, 18, 1 and its electron configuration is [Kr]4d10 5s1. The silver atom has a radius of 144 pm and a Van der Waals radius of 203 pm. Silver was first discovered by Early Man prior to 5000 BC. In its elemental form, silver has a brilliant white metallic luster. Elemental SilverIt is a little harder than gold and is very ductile and malleable, being exceeded only by gold and perhaps palladium. Pure silver has the highest electrical and thermal conductivity of all metals and possesses the lowest contact resistance. It is stable in pure air and water, but tarnishes when exposed to ozone, hydrogen sulfide, or air containing sulfur. It is found in copper, copper-nickel, lead, and lead-zinc ores, among others. Silver was named after the Anglo-Saxon word "seolfor" or "siolfur," meaning 'silver'.

Tin Bohr ModelSee more Tin products. Tin (atomic symbol: Sn, atomic number: 50) is a Block P, Group 14, Period 5 element with an atomic weight of 118.710. The number of electrons in each of tin's shells is 2, 8, 18, 18, 4 and its electron configuration is [Kr] 4d10 5s2 5p2. The tin atom has a radius of 140.5 pm and a Van der Waals radius of 217 pm.In its elemental form, tin has a silvery-gray metallic appearance. It is malleable, ductile and highly crystalline. High Purity (99.9999%) Tin (Sn) MetalTin has nine stable isotopes and 18 unstable isotopes. Under 3.72 degrees Kelvin, Tin becomes a superconductor. Applications for tin include soldering, plating, and such alloys as pewter. The first uses of tin can be dated to the Bronze Age around 3000 BC in which tin and copper were combined to make the alloy bronze. The origin of the word tin comes from the Latin word Stannum which translates to the Anglo-Saxon word tin. For more information on tin, including properties, safety data, research, and American Elements' catalog of tin products, visit the Tin element page.

Recent Research

Polyacrylamide-phytic acid-polydopamine conducting porous hydrogel for rapid detection and removal of copper (II) ions., Zhao, Zhen, Chen Hongda, Zhang Hua, Ma Lina, and Wang Zhenxin , Biosens Bioelectron, 2017 May 15, Volume 91, p.306-312, (2017)

Ratiometric detection of copper ions and alkaline phosphatase activity based on semiconducting polymer dots assembled with rhodamine B hydrazide., Sun, Junyong, Mei Han, and Gao Feng , Biosens Bioelectron, 2017 May 15, Volume 91, p.70-75, (2017)

Human and soil exposure during mechanical chlorpyrifos, myclobutanil and copper oxychloride application in a peach orchard in Argentina., Berenstein, Giselle, Nasello Soledad, Beiguel Érica, Flores Pedro, Di Schiena Johanna, Basack Silvana, Hughes Enrique A., Zalts Anita, and Montserrat Javier M. , Sci Total Environ, 2017 May 15, Volume 586, p.1254-1262, (2017)

Facile fabrication of Fe3O4 octahedra/nanoporous copper network composite for high-performance anode in Li-Ion batteries., Ye, Jiajia, Wang Zhihong, Hao Qin, Liu Binbin, and Xu Caixia , J Colloid Interface Sci, 2017 May 01, Volume 493, p.171-180, (2017)

Synthesis and characterizations of biscuit-like copper oxide for the non-enzymatic glucose sensor applications., Velmurugan, Murugan, Karikalan Natarajan, and Chen Shen-Ming , J Colloid Interface Sci, 2017 May 01, Volume 493, p.349-355, (2017)

Influence of CuSO4 and chelated copper algaecide exposures on biodegradation of microcystin-LR., Iwinski, Kyla J., Rodgers John H., Kinley Ciera M., Hendrikse Maas, Calomeni Alyssa J., McQueen Andrew D., Geer Tyler D., Liang Jenny, Friesen Vanessa, and Haakensen Monique , Chemosphere, 2017 May, Volume 174, p.538-544, (2017)

Ultra fast ultrasound-assisted decopperization from copper anode slime., Wang, Shixing, Cui Wei, Zhang Gengwei, Zhang Libo, and Peng Jinhui , Ultrason Sonochem, 2017 May, Volume 36, p.20-26, (2017)

Modeling competitive sorption of lead and copper ions onto alginate and greenly prepared algal-based beads., Wang, Shengye, Vincent Thierry, Faur Catherine, and Guibal Eric , Bioresour Technol, 2017 May, Volume 231, p.26-35, (2017)

Ultrafast self-assembly of silver nanostructures on carbon-coated copper grids for surface-enhanced Raman scattering detection of trace melamine., Cao, Qi, Yuan Kaiping, Yu Jun, Delaunay Jean-Jacques, and Che Renchao , J Colloid Interface Sci, 2017 Mar 15, Volume 490, p.23-28, (2017)

The interaction of surfactants with plastic and copper plumbing materials during decontamination., Casteloes, Karen S., Mendis Gamini P., Avins Holly K., Howarter John A., and Whelton Andrew J. , J Hazard Mater, 2017 Mar 05, Volume 325, p.8-16, (2017)

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April 24, 2017
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