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Bis(ethylenediamine)copper(II) Hydroxide Solution

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Linear Formula:


MDL Number:


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Bis(ethylenediamine)copper(II) Hydroxide Solution
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Bis(ethylenediamine)copper(II) Hydroxide Solution Properties (Theoretical)

Compound Formula C4H18CuN4O2
Molecular Weight 217.76
Appearance Blue liquid
Melting Point N/A
Boiling Point 119.7 °C
Density 1.806 g/mL
Solubility in H2O N/A
Exact Mass 217.072573
Monoisotopic Mass 217.072573

Bis(ethylenediamine)copper(II) Hydroxide Solution Health & Safety Information

Signal Word Danger
Hazard Statements H314
Hazard Codes C
Precautionary Statements P280-P305+P351+P338-P310
Risk Codes 34
Safety Statements 26-36/37/39-45
RTECS Number N/A
Transport Information UN 1761 8/PG II
WGK Germany 3
GHS Pictograms

About Bis(ethylenediamine)copper(II) Hydroxide Solution

Bis(ethylenediamine)copper(II) Hydroxide Solution is generally immediately available in most volumes, including bulk orders. American Elements can produce materials to custom specifications by request, in addition to custom compositions for commercial and research applications and new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as numerous other machined shapes and in the form of solutions and organometallic compounds. Ultra high purity and high purity forms also include metal powder, submicron powder and nanomaterials, targets for thin film deposition, and pellets for chemical vapor deposition (CVD) and physical vapor deposition (PVD) applications. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Additional technical, research and safety (MSDS) information is available as is a Reference Calculator for converting relevant units of measurement.

Bis(ethylenediamine)copper(II) Hydroxide Solution Synonyms

Copper(II)-ethylenediame complex; copper(II) ethylenediamine hydroxide; 1, 2-Ethanediamine - dihydroxycopper; cupric ethylenediamine hydroxide; Ethylenediamine copper(II) hydroxide; copper ethane-1, 2-diamine dihydroxide; Copper(2+), bis(1, 2-ethanediamine-kappaN1, kappaN2)-, hydroxide (1:2), (SP-4-1)-; komeen; 52769-67-2

Chemical Identifiers

Linear Formula Cu(C2H8N2)2(OH)2
MDL Number MFCD00274628
EC No. 238-597-7
Beilstein Registry No. N/A
Pubchem CID 167115
IUPAC Name copper; ethane-1,2-diamine; dihydroxide
SMILES C(CN)N.C(CN)N.[OH-].[OH-].[Cu+2]
InchI Identifier InChI=1S/2C2H8N2.Cu.2H2O/c2*3-1-2-4;;;/h2*1-4H2;;2*1H2/q;;+2;;/p-2

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a red-orange metallic luster appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity.The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus." Cyprus, a Mediterranean island, was known as an ancient source of mined copper.


June 16, 2019
Los Angeles, CA
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