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Copper(II) Oxide Sputtering Target

CAS #: 1317-38-0
Linear Formula:
CuO
MDL Number
MFCD00010974
EC No.:
215-270-7

ORDER

Product Product Code ORDER SAFETY DATA Technical data
(2N) 99% Copper Oxide Sputtering Target CU2-OX-02-ST SDS > Data Sheet >
(3N) 99.9% Copper Oxide Sputtering Target CU2-OX-03-ST SDS > Data Sheet >
(4N) 99.99% Copper Oxide Sputtering Target CU2-OX-04-ST SDS > Data Sheet >
(5N) 99.999% Copper Oxide Sputtering Target CU2-OX-05-ST SDS > Data Sheet >
WHOLESALE/SKU 0000-742-{{nid}}

Copper(II) Oxide Sputtering Target Properties (Theoretical)

Compound Formula CuO
Molecular Weight 79.55
Appearance solid
Melting Point 1,201° C (2,194° F)
Boiling Point 2,000° C (3,632° F)
Density 6.31 g/cm3
Solubility in H2O N/A
Exact Mass 78.9245 g/mol
Monoisotopic Mass 78.924516 Da

Copper(II) Oxide Sputtering Target Health & Safety Information

Signal Word Warning
Hazard Statements H400-H412
Hazard Codes Xn,N
Precautionary Statements P273
Flash Point Not applicable
Risk Codes 22-50/53
Safety Statements 60-61
RTECS Number GL7900000
Transport Information UN 3077 9 / PGIII
WGK Germany 3
GHS Pictogram
Image
Hazardous to the Aquatic Environment - GHS09

About Copper(II) Oxide Sputtering Target

Oxide IonAmerican Elements specializes in producing high purity Copper Oxide Sputtering Targets with the highest possible density High Purity (99.99%) Copper Oxide Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. We offer all shapes and configurations of targets compatible with all standard guns including circular, rectangular, annular, oval, "dog-bone," rotatable (rotary), multi-tiled and others in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce Copper Oxde as pellets, pieces, tablets, and powder. Oxide compounds are not conductive to electricity. However, certain perovskite structured oxides are electronically conductive finding application in the cathode of solid oxide fuel cells and oxygen generation systems. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Other shapes are available by request.

Synonyms

Copper(2+) oxide, Copper monooxide, Cupric oxide, Copporal, Oxocopper, Copper Brown, Black copper oxide, Paramelaconite Cuprous oxide, Copacaps, Boliden Salt K-33, Copper oxygen(2-), Ketocopper

Chemical Identifiers

Linear Formula CuO
Pubchem CID 14829
MDL Number MFCD00010974
EC No. 215-270-7
IUPAC Name copper; oxygen(2-)
Beilstein/Reaxys No. N/A
SMILES [Cu]=O
InchI Identifier InChI=1S/Cu.O
InchI Key QPLDLSVMHZLSFG-UHFFFAOYSA-N
Chemical Formula
Molecular Weight
Standard InchI
Appearance
Melting Point
Boiling Point
Density

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper.