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Platinum Oxide Sputtering Target

CAS #: 1314-15-4
Linear Formula:
PtO2
MDL Number
MFCD00011184
EC No.:
215-223-0

ORDER

Product Product Code ORDER SAFETY DATA Technical data
(2N) 99% Platinum Oxide Sputtering Target PT-OX-02-ST SDS > Data Sheet >
(3N) 99.9% Platinum Oxide Sputtering Target PT-OX-03-ST SDS > Data Sheet >
(4N) 99.99% Platinum Oxide Sputtering Target PT-OX-04-ST SDS > Data Sheet >
(5N) 99.999% Platinum Oxide Sputtering Target PT-OX-05-ST SDS > Data Sheet >
WHOLESALE/SKU 0000-742-{{nid}}

Platinum Oxide Sputtering Target Properties (Theoretical)

Compound Formula O2Pt
Molecular Weight 211.077
Appearance Brown Target
Melting Point 450 °C (842 °F)
Boiling Point N/A
Density 10.2 g/cm3
Solubility in H2O N/A
Exact Mass 210.96
Monoisotopic Mass 210.96

Platinum Oxide Sputtering Target Health & Safety Information

Signal Word Danger
Hazard Statements H272-H319
Hazard Codes O,Xi
Precautionary Statements P220-P305 + P351 + P338
Flash Point Not applicable
Risk Codes 8-36
Safety Statements 26
RTECS Number N/A
Transport Information UN 1479 5.1 / PGII
WGK Germany 2
GHS Pictogram
Image
Exclamation Point - GHS07
,
Image
Oxidizing Material - GHS03

About Platinum Oxide Sputtering Target

merican Elements specializes in producing high purity Platinum oxide sputtering targets with the highest possible density High Purity (99.99%) Metallic Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devises as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce Platinum Oxide as pellets, pieces, powder, and tablets. Oxide compounds are not conductive to electricity. However, certain perovskite structured oxides are electronically conductive finding application in the cathode of solid oxide fuel cells and oxygen generation systems. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Other shapes are available by request.

Synonyms

Adam’s catalyst, Platinic oxide, Platinum dioxide, Platinum monoxide, Diketoplatinum, Dioxoplatinum

Chemical Identifiers

Linear Formula PtO2
Pubchem CID 345198
MDL Number MFCD00011184
EC No. 215-223-0
IUPAC Name oxoplatinum
Beilstein/Reaxys No. N/A
SMILES O=[Pt]
InchI Identifier InChI=1S/O.Pt
InchI Key MUMZUERVLWJKNR-UHFFFAOYSA-N
Chemical Formula
Molecular Weight
Standard InchI
Appearance
Melting Point
Boiling Point
Density

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Platinum products. Platinum (atomic symbol: Pt, atomic number: 78) is a Block D, Group 10, Period 6 element with an atomic weight of 195.084. The number of electrons in each of platinum's shells is [2, 8, 18, 32, 17, 1] and its electron configuration is [Xe] 4f14 5d9 6s1. The platinum atom has a radius of 139 pm and a Van der Waals radius of 175 pm. Platinum Bohr ModelElemental PlatinumPlatinum was discovered and first isolated by Antonio de Ulloa in 1735. It is one of the rarest elements in the earth's crust, occurring at a concentration of only 0.005 ppm. Platinum is found uncombined as a free element and alloyed with iridium as platiniridium. In its elemental form, platinum has a grayish white appearance. It is highly resistant to corrosion: the metal does not oxidize in air at any temperature. It is generally non-reactive, even at high temperatures. The origin of the name "platinum" comes from the Spanish word platina, meaning silver.