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Boron Oxide Sputtering Target

CAS #: 1303-86-2
Linear Formula:
B2O3
MDL Number
MFCD00191837
EC No.:
215-125-8

ORDER

Product Product Code ORDER SAFETY DATA Technical data
(3N) 99.9% Boron Oxide Sputtering Target BO-OX-03-ST SDS > Data Sheet >
(4N) 99.99% Boron Oxide Sputtering Target BO-OX-04-ST SDS > Data Sheet >
(5N) 99.999% Boron Oxide Sputtering Target BO-OX-05-ST SDS > Data Sheet >
(2N) 99% Boron Oxide Sputtering Target BO-OX-02-ST SDS > Data Sheet >
WHOLESALE/SKU 0000-742-{{nid}}

Boron Oxide Sputtering Target Properties (Theoretical)

Compound Formula B2O3
Molecular Weight 69.62
Appearance White Crystalline Solid
Melting Point 510 °C (950 °F)
Boiling Point 1860 °C (3380 °F)
Density 2.46 g/cm3
Solubility in H2O N/A
Exact Mass N/A
Monoisotopic Mass 70.003356 Da

Boron Oxide Sputtering Target Health & Safety Information

Signal Word Danger
Hazard Statements N/A
Hazard Codes H360FD
Precautionary Statements P201-P202-P280-P308+P313-P405
Flash Point Not applicable
Risk Codes 36/37/38
Safety Statements 26-36
RTECS Number N/A
Transport Information NONH
WGK Germany 3
GHS Pictogram
Image
Skull and Crossbones - GHS06
,
Image
Health Hazard - GHS08

About Boron Oxide Sputtering Target

Oxide IonAmerican Elements specializes in producing high purity Boron Oxide Sputtering Targets with the highest possible density High Purity (99.99%) Boron Oxide Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. We offer all shapes and configurations of targets compatible with all standard guns including circular, rectangular, annular, oval, "dog-bone," rotatable (rotary), multi-tiled and others in standard, custom, and research sized dimensions. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce Boron Oxide as rods, powder and plates. Oxide compounds are not conductive to electricity. However, certain perovskite structured oxides are electronically conductive finding application in the cathode of solid oxide fuel cells and oxygen generation systems. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Other shapes are available by request.

Synonyms

Boric anhydride, Boric oxide, Keto-ketaboranyloxy-borane, Diboron trioxide, Boron trioxide, Dioxodiboroxane, Boron anhydride, borane, 1,1'-oxybis[1-oxo, Oxo-oxoboranyloxy-borane

Chemical Identifiers

Linear Formula B2O3
Pubchem CID 16212772
MDL Number MFCD00191837
EC No. 215-125-8
IUPAC Name oxo(oxoboranyloxy)borane
Beilstein/Reaxys No. N/A
SMILES O=BOB=O
InchI Identifier InChI=1S/B2O3/c3-1-5-2-4
InchI Key JKWMSGQKBLHBQQ-BHBJOZJASA-N
Chemical Formula
Molecular Weight
Standard InchI
Appearance
Melting Point
Boiling Point
Density

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Boron products. Boron Bohr ModelBoron (atomic symbol: B, atomic number: 5) is a Block P, Group 13, Period 2 element with an atomic weight of 10.81. The number of electrons in each of boron's shells is 2, 3 and its electron configuration is [He] 2s2 2p1. The boron atom has a radius of 90 pm and a Van der Waals radius of 192 pm. Boron was discovered by Joseph Louis Gay-Lussac and Louis Jacques Thénard in 1808 and was first isolated by Humphry Davy later that year. Boron is classified as a metalloid is not found naturally on earth. Elemental BoronAlong with carbon and nitrogen, boron is one of the few elements in the periodic table known to form stable compounds featuring triple bonds. Boron has an energy band gap of 1.50 to 1.56 eV, which is higher than that of either silicon or germanium. Boron is found in borates, borax, boric acid, colemanite, kernite, and ulexite.The name Boron originates from a combination of carbon and the Arabic word buraqu meaning borax.