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Copper Sputtering Target
High Purity Cu Sputtering Target
7440-50-8
Product Product Code Order or Specifications
(2N) 99% Copper Sputtering Target CU-M-02-ST Contact American Elements
(2N5) 99.5% Copper Sputtering Target CU-M-025-ST Contact American Elements
(3N) 99.9% Copper Sputtering Target CU-M-03-ST Contact American Elements
(3N5) 99.95% Copper Sputtering Target CU-M-035-ST Contact American Elements
(4N) 99.99% Copper Sputtering Target CU-M-04-ST Contact American Elements
(5N) 99.999% Copper Sputtering Target CU-M-05-ST Contact American Elements
(6N) 99.9999% Copper Sputtering Target CU-M-06-St Contact American Elements

 

CHEMICAL
IDENTIFICATION
Formula CAS No. PubChem
SID
PubChem CID MDL No. EC No Beilstein
Re. No.
SMILES
Identifier
InChI
Identifier
InChI
Key
Cu 7440-50-8 24847820 23978 MFCD00010965 231-159-6   [Cu] InChI=1S/Cu RYGMFSIKBFXOCR-UHFFFAOYSA-N

Mol. Wt. Appearance Density Tensile Strength Melting Point Boiling Point Thermal Conductivity Electrical Resistivity Eletronegativity Specific Heat Heat of Vaporization Heat of Fusion MSDS
63.55 Reddish Metal 8.96 gm/cc N/A 1083.4°C 2567°C 4.01 W/cm/K @ 298.2 K 1.678 microhm-cm @ 20°C 1.9 Paulings 0.092 Cal/g/K @ 25°C 72.8 K-cal/gm atom at 2567°C 3.11 Cal/gm mole Safety Data Sheet


American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopeia/British Pharmacopeia) and follows applicable ASTM testing standards.See safety data and research below and pricing/lead time above. American Elements specializes in producing high purity Copper sputtering targets with the highest possible density High Purity (99.9999%) Copper (Cu) Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devises as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. We also produce Copper as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.

Copper(Cu) atomic and molecular weight, atomic number and elemental symbolCopper is a Block D, Group 11, Period 4 element. The number of electrons in each of Copper's shells is 2, 8, 18, 1 and its electronic configuration is [Ar] 3d10 4s1. In its elemental form copper's CAS number is 7440-50-8. The copper atom has a radius of 127.8 .pm and it's Van der Waals radius is 140.pm. Copper is an essential trace element in animals and plants, but in excess copper is toxic. Due to its high electrical conductivity, large amounts of copper are used by the electrical industry for wire. Of all pure metals, only silver has a higher electrical conductivity. Copper is also resistant to corrosion caused by moisture, making it a widely used material in pipes, coins, and jewelry. Copper is often too soft for its applications, so it is incorporated in numerous alloys. For example, brass is a copper-zinc alloy, and bronze is a copper-tin alloy. Copper sulfate (CuSO 4·H2O), also known as blue vitrol, is the most well-known Elemental Coppercopper compound. It is used as Copper Bohr Modelan agricultural poison, an algicide, and as a pigment for inks. Cuprous chloride (CuCl) is a powder used to absorb carbon dioxide (CO2). Copper cyanide (CuCN) is often used in electroplating applications. Copper is available as metal and compounds with purities from 99% to 99.9999% (ACS grade to ultra-high purity); metals in the form of foil, sputtering target, and rod, and compounds as submicron and nanopowder. Copper was first discovered by Early Man. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus". Cyprus, a Mediterranean island, was known as an ancient source of mined copper. See Copper research below.

Have a Question? Ask a Chemical Engineer or Material Scientist   Request an MSDS or Certificate of Analysis

 
Safety &
Handling
  Flame-Flammables Environment-Hazardous to the aquatic environment        
Signal Word Hazard Statements Hazard Codes Risk Codes Safety Precautions RTECS No. Transport Information WGK Germany
Danger H228-H400 F 11 16 GL5325000 UN 3089 4.1/PG 2 3

 

PACKAGING SPECIFICATIONS FOR BULK & RESEARCH QUANTITIES


Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Material Safety Data Sheet (MSDS). Bullion and bar forms are best if purchasing solely for physical possession and risk exposure.


 

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Recent Research & Development for Copper

  • Altered intracellular localization and valosin-containing protein (p97 VCP) interaction underlie ATP7A-related distal motor neuropathy. Yi L, Donsante A, Kennerson ML, Mercer JF, Garbern JY, Kaler SG. Hum Mol Genet. 2011 Dec 30. [Epub ahead of print] PMID: 22210628 [PubMed - as supplied by publisher]

  • Chitinolytic and Chitosanolytic Activities from Crude Cellulase Extract Produced by A. niger Grown on Apple Pomace Through Koji Fermentation. Dhillon GS, Brar SK, Kaur S, Valero JR, Verma M. J Microbiol Biotechnol. 2011 Dec;21(12):1312-21. PMID: 22210619 [PubMed - in process]

  • Structural and functional recovery of microbial biofilms after a decrease in copper exposure: Influence of the presence of pristine communities. Lambert AS, Morin S, Artigas J, Volat B, Coquery M, Neyra M, Pesce S. Aquat Toxicol. 2011 Dec 14;109C:118-126. [Epub ahead of print] PMID: 22210500 [PubMed - as supplied by publisher]

  • Effects of copper on osmoregulation in sheepshead minnow, Cyprinodon variegatus acclimated to different salinities. Adeyemi JA, Deaton LE, Pesacreta TC, Klerks PL. Aquat Toxicol. 2011 Dec 14;109C:111-117. [Epub ahead of print] PMID: 22210499 [PubMed - as supplied by publisher]

  • Characterization of the Chitinolytic Machinery of Enterococcus faecalis V583 and High-Resolution Structure of Its Oxidative CBM33 Enzyme. Vaaje-Kolstad G, Bøhle LA, Gåseidnes S, Dalhus B, Bjørås M, Mathiesen G, Eijsink VG. J Mol Biol. 2011 Dec 22. [Epub ahead of print] PMID: 22210154 [PubMed - as supplied by publisher]

  • Electrochemistry of copper(II) induced complexes in mycorrhizal maize plant tissues. Zitka O, Merlos MA, Adam V, Ferrol N, Pohanka M, Hubalek J, Zehnalek J, Trnkova L, Kizek R. J Hazard Mater. 2011 Dec 13. [Epub ahead of print] PMID: 22209587 [PubMed - as supplied by publisher]

  • The metal binding abilities of Megathura crenulata metallothionein (McMT) in the frame of Gastropoda MTs. Pérez-Rafael S, Mezger A, Lieb B, Dallinger R, Capdevila M, Palacios O, Atrian S. J Inorg Biochem. 2011 Dec 3. [Epub ahead of print] PMID: 22209022 [PubMed - as supplied by publisher]

  • Photoluminescence quenching/recovery kinetics of [Ru(bpy)(2)(tatp)](2+) and [Ru(bpy)(2)(dmtatp)](2+) intercalated within DNA by copper(II) ions and EDTA. Ji S, Chen M, Gan G, Li H, Li W. Spectrochim Acta A Mol Biomol Spectrosc. 2011 Dec 16. [Epub ahead of print] PMID: 22208960 [PubMed - as supplied by publisher]

  • Peculiarities of copper binding to alpha-synuclein. Ahmad A, Burns CS, Fink AL, Uversky VN. J Biomol Struct Dyn. 2012 Feb;29(4):825-42. PMID: 22208282 [PubMed - in process]

  • Role of Vitamin C and E Supplementation on IL-6 in response to Training. Yfanti C, Fischer CP, Nielsen S, Akerström T, Nielsen AR, Veskoukis AS, Kouretas D, Lykkesfeldt J, Pilegaard H, Pedersen BK. J Appl Physiol. 2011 Dec 29. [Epub ahead of print] PMID: 22207723 [PubMed - as supplied by publisher]

  • Zinc, Ferritin, Magnesium and Copper in a group of Egyptian Children with Attention Deficit Hyperactivity Disorder. Mahmoud MM, El-Mazary AA, Maher RM, Saber MM. Ital J Pediatr. 2011 Dec 29;37(1):60. [Epub ahead of print] PMID: 22206662 [PubMed - as supplied by publisher]

  • Copper-Catalyzed Aerobic Oxidative Intramolecular C-H Amination Leading to Imidazobenzimidazole Derivatives. Wang X, Jin Y, Zhao Y, Zhu L, Fu H. Org Lett. 2011 Dec 29. [Epub ahead of print] PMID: 22206482 [PubMed - as supplied by publisher]

  • High-Throughput Graphene Imaging on Arbitrary Substrates with Widefield Raman Spectroscopy. Havener RW, Ju SY, Brown L, Wang Z, Wojcik M, Ruiz-Vargas CS, Park J. ACS Nano. 2011 Dec 29. [Epub ahead of print] PMID: 22206260 [PubMed - as supplied by publisher]

  • Triarylboron-Functionalized Cu(II) Carboxylate Paddlewheel Complexes. Blight BA, Stewart AF, Wang N, Lu JS, Wang S. Inorg Chem. 2011 Dec 28. [Epub ahead of print] PMID: 22206219 [PubMed - as supplied by publisher]

  • Application of a topical biomimetic electrical signaling technology to photo-aging: a randomized, double-blind, placebo-controlled trial of a galvanic zinc-copper complex. Chantalat J, Bruning E, Sun Y, Liu JC. J Drugs Dermatol. 2012 Jan 1;11(1):30-7. PMID: 22206074 [PubMed - in process]

  • Assessment of Metal Pollution in Soils From a Former Havana (Cuba) Solid Waste Open Dump. Díaz Rizo O, Hernández Merlo M, Echeverría Castillo F, Arado López JO. Bull Environ Contam Toxicol. 2011 Dec 29. [Epub ahead of print] PMID: 22205471 [PubMed - as supplied by publisher]

  • Coordination chemistry of copper proteins: How nature handles a toxic cargo for essential function. Rubino JT, Franz KJ. J Inorg Biochem. 2011 Dec 3;107(1):129-143. [Epub ahead of print] PMID: 22204943 [PubMed - as supplied by publisher]

  • Palm oil fruit shells as biosorbent for copper removal from water and wastewater: Experiments and sorption models. Hossain MA, Ngo HH, Guo WS, Nguyen TV. Bioresour Technol. 2011 Dec 9. [Epub ahead of print] PMID: 22204888 [PubMed - as supplied by publisher]

  • Effective and reversible DNA condensation induced by bifunctional molecules containing macrocyclic polyamines and naphthyl moieties. Yan H, Li ZF, Guo ZF, Lu ZL, Wang F, Wu LZ. Bioorg Med Chem. 2011 Dec 8. [Epub ahead of print] PMID: 22204742 [PubMed - as supplied by publisher]

  • Fish quarantine: current practices in public zoos and aquaria. Hadfield CA, Clayton LA. J Zoo Wildl Med. 2011 Dec;42(4):641-50. PMID: 22204059 [PubMed - in process]

     

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