American Elements: Copper Sputtering Target Supplier & Tech Info

See research below. American Elements specializes in producing high purity Copper sputtering targets with the highest possible density High Purity (99.99%) Metallic Sputtering Target

High Purity (99.99%) Metallic Sputtering Target

and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard Sputtering Targets for thin film are available monoblock or bonded with dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devises as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys. All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. We also produce Copper as disc, granules, ingot, pellets, pieces, powder, and rod. Other shapes are available by request.

Copper is a Block D, Group 11, Period 4 element. The electronic configuration is [Ar] 3d¹⁰ 4s¹. In its elemental form copper's CAS number is 7440-50-8. The copper atom has a radius of 127.8 .pm and it's Van der Waals radius is 140.pm. Due to its high electrical conductivity, large amounts of copper are used by the electrical industry for wire. Of all pure metals, only silver has a higher electrical conductivity. Copper is also resistant to corrosion caused by moisture, making it a widely used material in pipes, coins, and jewelry. Copper is often too soft for its applications, so it is incorporated in numerous alloys. For example, brass is a copper-zinc alloy, and bronze is a copper-tin alloy. Copper sulfate (CuSO 4·H2O), also known as blue vitrol, is the most well-known copper compound. It is used as an agricultural poison, an algicide, and as a pigment for inks. Cuprous chloride (CuCl) is a powder used to absorb carbon dioxide (CO2). Copper cyanide (CuCN) is often used in electroplating applications. Copper is available as metal and compounds with purities from 99% to 99.9999% (ACS grade to ultra-high purity); metals in the form of foil, sputtering target, and rod, and compounds as submicron and nanopowder.