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Copper Nanorods

CAS #: 7440-50-8
Linear Formula:
Cu
MDL Number
MFCD00010965
EC No.:
231-159-6

ORDER

Product Product Code ORDER SAFETY DATA Technical data
(2N) 99% Copper Nanorods CU-M-02-NR SDS > Data Sheet >
(3N) 99.9% Copper Nanorods CU-M-03-NR SDS > Data Sheet >
(4N) 99.99% Copper Nanorods CU-M-04-NR SDS > Data Sheet >
(5N) 99.999% Copper Nanorods CU-M-05-NR SDS > Data Sheet >
WHOLESALE/SKU 0000-742-10867

Copper Nanorods Properties (Theoretical)

Molecular Weight 63.55
Appearance Reddish Metal
Melting Point 1085°C
Boiling Point 2562°C
Density 8.96 g/cm3
Solubility in H2O N/A
Poisson's Ratio 0.34
Young's Modulus 110–128 GPa
Vickers Hardness 369 MPa
Thermal Conductivity 401 W·m-1·K-1
Thermal Expansion (25 °C) 16.5 µm·m-1·K-1
Electrical Resistivity 1.673 μΩ-cm @ 20°C
Electronegativity 1.90 Paulings
Specific Heat 0.39 kJ/kg K
Heat of Fusion 13.26 kJ·mol-1
Heat of Vaporization 300.4 kJ·mol-1

Copper Nanorods Health & Safety Information

Signal Word Danger
Hazard Statements H228-H400
Hazard Codes F
Risk Codes 11
Safety Statements 16
RTECS Number GL5325000
Transport Information UN 3089 4.1/PG 2
WGK Germany 3
GHS Pictogram
Image
Flammable - GHS02
,
Image
Exclamation Point - GHS07

About Copper Nanorods

Copper Nanorods are elongated particles ranging from 10 to 120 nanometers (nm) with specific surface area (SSA) in the 30 - 70 m2/g range. Nano Copper is also available passivated and in Ultra high purity and high purity and coated and dispersed forms. They are also available as a dispersion through the AE Nanofluid production group. Nanofluids are generally defined as suspended nanorods in solution either using surfactant or surface charge technology. Nanofluid dispersion and coating selection technical guidance is also available. Other nanostructures include nanoparticles, nanowhiskers, nanohorns, nanopyramids and other nanocomposites. Surface functionalized nanorods allow for the particles to be preferentially adsorbed at the surface interface using chemically bound polymers. Development research is underway in Nano Electronics and Photonics materials, such as MEMS and NEMS, Bio Nano Materials, such as Biomarkers, Bio Diagnostics & Bio Sensors, and Related Nano Materials, for use in Polymers, Textiles, Fuel Cell Layers , Composites and Solar Energy materials. Nanopowders are analyzed for chemical composition by ICP, particle size distribution (PSD) by laser diffraction, and for Specific Surface Area (SSA) by BET multi-point correlation techniques. Novel nanotechnology applications also include quantum dots . High surface areas can also be achieved using solutions and using thin film by sputtering targets and evaporation technology using pellets, rod and foil Applications for Copper nanorods generally involve their magnetic properties and include in catalysts and magnetic recording and in medical sensors and bio medicine as a contrast enhancement agent for magnetic resonance imaging (MRI). Copper particles are being tested for site specific drug delivery agents for cancer therapies and in coatings, plastics, nanowire, nanofiber and textiles and in certain alloy and catalyst applications . Further research is being done for their potential electrical, dielectric, magnetic, optical, imaging, catalytic, biomedical and bioscience properties. Copper Nano Particles are generally immediately available in most volumes. Additional technical, research and safety (MSDS) information is available.

Synonyms

Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper

Chemical Identifiers

Linear Formula Cu
MDL Number MFCD00010965
EC No. 231-159-6
Beilstein/Reaxys No. N/A
SMILES [Cu]
InchI Identifier InChI=1S/Cu
InchI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Chemical Formula
Molecular Weight
Standard InchI
Appearance
Melting Point
Boiling Point
Density

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper.