View the history of American Elements on Wikipedia

Copper Nanorods

CAS #: 7440-50-8

Linear Formula:

MDL Number

MFCD00010965

EC No.:

231-159-6

ORDER

Product	Product Code	ORDER	SAFETY DATA	Technical data
(2N) 99% Copper Nanorods	CU-M-02-NR	Pricing Add to cart only	SDS >	Data Sheet >
(3N) 99.9% Copper Nanorods	CU-M-03-NR	Pricing Add to cart only	SDS >	Data Sheet >
(4N) 99.99% Copper Nanorods	CU-M-04-NR	Pricing Add to cart only	SDS >	Data Sheet >
(5N) 99.999% Copper Nanorods	CU-M-05-NR	Pricing Add to cart only	SDS >	Data Sheet >

Question? Ask an American Elements Materials Science Engineer

Copper Nanorods Properties (Theoretical)

Molecular Weight	63.55
Appearance	Reddish Metal
Melting Point	1085°C
Boiling Point	2562°C
Density	8.96 g/cm³
Solubility in H2O	N/A
Poisson's Ratio	0.34
Young's Modulus	110–128 GPa
Vickers Hardness	369 MPa
Thermal Conductivity	401 W·m-1·K-1
Thermal Expansion	(25 °C) 16.5 µm·m^-1·K^-1
Electrical Resistivity	1.673 μΩ-cm @ 20°C
Electronegativity	1.90 Paulings
Specific Heat	0.39 kJ/kg K
Heat of Fusion	13.26 kJ·mol^-1
Heat of Vaporization	300.4 kJ·mol^-1

Copper Nanorods Health & Safety Information

Signal Word	Danger
Hazard Statements	H228-H400
Hazard Codes	F
Risk Codes	11
Safety Statements	16
RTECS Number	GL5325000
Transport Information	UN 3089 4.1/PG 2
WGK Germany	3
GHS Pictogram	Image , Image

About Copper Nanorods

Copper Nanorods are elongated particles ranging from 10 to 120 nanometers (nm) with specific surface area (SSA) in the 30 - 70 m²/g range. Nano Copper is also available passivated and in Ultra high purity and high purity and coated and dispersed forms. They are also available as a dispersion through the AE Nanofluid production group. Nanofluids are generally defined as suspended nanorods in solution either using surfactant or surface charge technology. Nanofluid dispersion and coating selection technical guidance is also available. Other nanostructures include nanoparticles, nanowhiskers, nanohorns, nanopyramids and other nanocomposites. Surface functionalized nanorods allow for the particles to be preferentially adsorbed at the surface interface using chemically bound polymers. Development research is underway in Nano Electronics and Photonics materials, such as MEMS and NEMS, Bio Nano Materials, such as Biomarkers, Bio Diagnostics & Bio Sensors, and Related Nano Materials, for use in Polymers, Textiles, Fuel Cell Layers , Composites and Solar Energy materials. Nanopowders are analyzed for chemical composition by ICP, particle size distribution (PSD) by laser diffraction, and for Specific Surface Area (SSA) by BET multi-point correlation techniques. Novel nanotechnology applications also include quantum dots . High surface areas can also be achieved using solutions and using thin film by sputtering targets and evaporation technology using pellets, rod and foil Applications for Copper nanorods generally involve their magnetic properties and include in catalysts and magnetic recording and in medical sensors and bio medicine as a contrast enhancement agent for magnetic resonance imaging (MRI). Copper particles are being tested for site specific drug delivery agents for cancer therapies and in coatings, plastics, nanowire, nanofiber and textiles and in certain alloy and catalyst applications . Further research is being done for their potential electrical, dielectric, magnetic, optical, imaging, catalytic, biomedical and bioscience properties. Copper Nano Particles are generally immediately available in most volumes. Additional technical, research and safety (MSDS) information is available.

Synonyms

Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper

Chemical Identifiers

Linear Formula	Cu
MDL Number	MFCD00010965
EC No.	231-159-6
Beilstein/Reaxys No.	N/A
SMILES	[Cu]
InchI Identifier	InChI=1S/Cu
InchI Key	RYGMFSIKBFXOCR-UHFFFAOYSA-N
Chemical Formula
Molecular Weight
Standard InchI
Appearance
Melting Point
Boiling Point
Density

Customers For Copper Nanorods Have Also Viewed

Copper Nanowire Dispersion

Copper Nanoparticle Dispersion

Ultra Thin Copper Nanoscale Foil

Copper Nanoparticles

Copper Nanotubes

Copper Nanowires

(6N) 99.9999% Copper Metal

Copper Cube

Silver Coated Copper Powder

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Related Elements

See more Copper products. Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d¹⁰ 4s¹. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver has a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper.