Linear Formula:

Pd-Cu

MDL Number:

N/A

EC No.:

N/A

ORDER

PRODUCT Product Code ORDER SAFETY DATA TECHNICAL DATA
(2N) 99% Palladium Copper Sputtering Target
PD-CU-02-ST
Pricing > SDS > Data Sheet >
(2N5) 99.5% Palladium Copper Sputtering Target
PD-CU-025-ST
Pricing > SDS > Data Sheet >
(3N) 99.9% Palladium Copper Sputtering Target
PD-CU-03-ST
Pricing > SDS > Data Sheet >
(3N5) 99.95% Palladium Copper Sputtering Target
PD-CU-035-ST
Pricing > SDS > Data Sheet >
(4N) 99.99% Palladium Copper Sputtering Target
PD-CU-04-ST
Pricing > SDS > Data Sheet >
(5N) 99.999% Palladium Copper Sputtering Target
PD-CU-05-ST
Pricing > SDS > Data Sheet >

Palladium Copper Sputtering Target Properties (Theoretical)

Compound Formula PdCu
Appearance Metallic target
Melting Point 1200 °C
Boiling Point N/A
Density 11.0 g/cm3
Solubility in H2O N/A
Heat of Fusion 180 J/g
Poisson's Ratio 0.37
Specific Heat 300 J/kg-K
Tensile Strength 660-1150 MPa
Thermal Expansion 14.1 µm/m-K
Young's Modulus 120 GPa
Monoisotopic Mass 168.833 g/mol

Palladium Copper Sputtering Target Health & Safety Information

Signal Word N/A
Hazard Statements N/A
Hazard Codes N/A
Risk Codes N/A
Safety Statements N/A
Transport Information NONH for all modes of transport

About Palladium Copper Sputtering Target

American Elements specializes in producing high purity Palladium Copper Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard sputtering targets for thin film deposition are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Rotary (cylindrical), round, rectangular, square, ring, annular, oval, "dog-bone" and other shaped targets are available in standard, custom, and research sized dimensions . All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Please request a quote above for more information on lead time and pricing.

Palladium Copper Sputtering Target Synonyms

Pd60Cu40, ASTM B685, CAS 12381-74-7), CAS 56780-39-3, CuPd2, CAS 186027-91-8, Cu2Pd3, CAS 78402-97-8, Cu6Pd4, CAS , CAS ,

Chemical Identifiers

Linear Formula Pd-Cu
MDL Number N/A
EC No. N/A
Pubchem CID 11378738
IUPAC Name copper; palladium
SMILES [Cu].[Pd]
InchI Identifier InChI=1S/Cu.Pd
InchI Key XPPWAISRWKKERW-UHFFFAOYSA-N

Packaging Specifications

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.

Payment Methods

American Elements accepts checks, wire transfers, ACH, most major credit and debit cards (Visa, MasterCard, AMEX, Discover) and Paypal.

For the convenience of our international customers, American Elements offers the following additional payment methods:

SOFORT bank tranfer payment for Austria, Belgium, Germany and SwitzerlandJCB cards for Japan and WorldwideBoleto Bancario for BraziliDeal payments for the Netherlands, Germany, Austria, Belgium, Italy, Poland, Spain, Switzerland, and the United KingdomGiroPay for GermanyDankort cards for DenmarkElo cards for BrazileNETS for SingaporeCartaSi for ItalyCarte-Bleue cards for FranceChina UnionPayHipercard cards for BrazilTROY cards for TurkeyBC cards for South KoreaRuPay for India

Related Elements

Copper

See more Copper products. Copper Bohr Model Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver Elemental Copperhas a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper..

Palladium

Palladium Bohr ModelSee more Palladium products. Palladium (atomic symbol: Pd, atomic number: 46) is a Block D, Group 10, Period 5 element with an atomic weight of 106.42. The number of electrons in each of palladium's shells is 2, 8, 18, 18 and its electron configuration is [Kr] 4d10. The palladium atom has a radius of 137 pm and a Van der Waals radius of 202 pm. In its elemental form, palladium has a silvery white appearance. Palladium is a member of the platinum group of metals (along with platinum, rhodium, ruthenium, iridium and osmium). Elemental PalladiumPalladium has the lowest melting point and is the least dense of the group. Palladium can be found as a free metal and alloyed with other platinum-group metals. Nickel-copper deposits are the main commercial source of palladium. Palladium was discovered and first isolated by William Hyde Wollaston in 1803. Its name is derived from the asteroid Pallas.

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