American Elements Logo and U.S. Registered Trademark

 

SPUTTERING TARGET, THIN FILM, FOIL, DEPOSITION MATERIAL, EVAPORATION MATERIAL, ROD, WIRE, BAR, SHEET, INGOT, PLATE

American Elements specializes in high purity metal shapes and Evaporation and Pre-Melted Material (Oxide and Fluoride) with the highest density and smallest grain sizes for use in chemical vapor deposition (CVD) and physical vapor deposition (PVD) for thin film, optic and electronic applications.

32.4 (A)/00.0013

   

American Elements is a world leader in Sputtering Target, Foil, Rod, Wire, Bar, Sheet, Plate and < 0.5 mm Thin Film from rare earth and other electronic and optic materials.  American Elements produces high purity metals and compounds with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical deposition and physical vapor deposition (PVD) display and optical applications. We also produce the rare earths and most advanced metals as cast rods and plates.99.999% Gold Foil for chemical vapor deposition


Materials are produced using crystallization, solid state and other ultra high purification processes. American Elements specializes in producing custom compositions for research and new proprietary technologies.

Indium Sputtering Target

 

Sputtering Targets. Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. Other shapes are available by request.

All machined pieces are produced by casting oversized blanks, and machining down to required specifications. They are usually machined to tolerances of +0.010"/-0" on diameter, length or width, and +/-0.005" on thickness. Larger targets are also finished to a flatness within 0.015". We can accommodate tighter tolerances upon request.


Foils. American Elements produces rolled foils and sheets in various thicknesses and sizes. Most foils are produced from cast ingots for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Scandium foils are produced from distilled scandium that does not contain tantalum. Thickness can range from 0.003" to approximately 2mm for all metals. Some metals can also be rolled down as thin as 0.001". Piece sizes are available up to approximately 7" maximum width. Maximum lengths of about 20" can be obtained with a nominal thickness between about 0.005" and 0.020".

99.999% Copper Foil 99.999% Dysprosium Foil 99.999% Gold Foil

Rods and Plates. American Elements casts any of the rare earth metals and most other advanced material into rod, bar or plate form, as well as other machined shapes. All as-cast rods, bars and plates are produced from either the pure metal ingots or sublimed metals. We have a variety of standard sized rod molds, from a minimum of 1/4" diameter up to 3" diameter for most rod needs. Plates are also offered in standard thicknesses, from 1/4" thick to 1" thick. Maximum rod lengths and maximum plate sizes are dependent on melt capacity and furnace room. Small diameter rods may have only a 4"-6" maximum cast length, whereas larger diameter rods may be cast up to about 16" long. Plate sizes can be cast up to a size of 24" x 16". As-cast rods or plates are saw-cut to length or final dimensions, and the metal surface may have visible flow marks.

American Elements manufactures the following sputtering targets for thin film commercial, industrial and research applications, including solar energy and fuel cell applications:

Aluminum Sputtering Target

Aluminum-Copper Sputtering Target

Aluminum-Copper-Silicon Sputtering Target

Aluminum Fluoride Sputtering Target

Aluminum Oxide Sputtering Target

Aluminum-Silicon Sputtering Target

Antimony Sputtering Target

Antimony Oxide Sputtering Target

Antimony-Telluride Sputtering Target

Arsenic Sputtering Target

Arsenic Oxide Sputtering Target

Barium Fluoride Sputtering Target

Barium Oxide Sputtering Target

Barium Sputtering Target

Beryllium Sputtering Target

Beryllium Oxide Sputtering Target

Bismuth Sputtering Target

Bismuth Fluoride Sputtering Target

Bismuth Oxide Sputtering Target

Boron Sputtering Target

Boron Carbide Sputtering Target

Boron Oxide Sputtering Target

Cadmium Sputtering Target

Cadmium Fluoride Sputtering Target

Cadmium Oxide Sputtering Target

Chromium Sputtering Target

Calcium Sputtering Target

Calcium Fluoride Sputtering Target

Calcium Oxide Sputtering Target

Cerium Sputtering Target

Cerium Fluoride Sputtering Target

Cerium Oxide Sputtering Target

Cesium Sputtering Target

Cesium Oxide Sputtering Target

Chromium Sputtering Target

Chromium Oxide Sputtering Target

Cobalt Sputtering Target

Cobalt Oxide Sputtering Target

Copper Sputtering Target

Copper-Chrome Sputtering Target

Copper Fluoride Sputtering Target

Copper Gallium Selenide Sputtering Target

Copper Indium Selenide Sputtering Target

Copper-Nickel Sputtering Target

Copper Oxide Sputtering Target

Copper Selenide Sputtering Target

Copper Sputtering Target

Dysprosium Sputtering Target

Dysprosium Fluoride Sputtering Target

Dysprosium Oxide Sputtering Target

Erbium Sputtering Target

Erbium Fluoride Sputtering Target

Erbium Oxide Sputtering Target

Europium Sputtering Target

Europium Fluoride Sputtering Target

Europium Oxide Sputtering Target

Gadolinium doped Ceria Sputtering Target

Gallium Sputtering Target

Gallium Fluoride Sputtering Target

Gallium Oxide Sputtering Target

Gallium Selenide Sputtering Target

Gadolinium Sputtering Target

Gadolinium Fluoride Sputtering Target

Gadolinium Oxide Sputtering Target

Germanium Sputtering Target

Germanium-Antimony Sputtering Target

Germanium Oxide Sputtering Target

Gold Sputtering Target

Gold-Antimony Sputtering Target

Gold-Copper Sputtering Target

Gold-germanium Sputtering Target

Gold-Silicon Sputtering Target

Gold-tin Sputtering Target

Hafnium Sputtering Target

Hafnium Carbide Sputtering Target

Hafnium Oxide Sputtering Target

Holmium Sputtering Target

Holmium Fluoride Sputtering Target

Holmium Oxide Sputtering Target

Indium Sputtering Target

Indium Fluoride Sputtering Target

Indium Oxide Sputtering Target

 

Indium Selenide Sputtering Target

Indium-Tin oxide (ITO) Sputtering Target

Iridium Sputtering Target

Iridium Oxide Sputtering Target

Iron Sputtering Target

Iron Fluoride Sputtering Target

Iron Oxide Sputtering Target

Lanthanum Strontium Chromite (LSC) Sputtering Target

Lanthanum Strontium Cobaltite Ferrite (LSCF) Sputtering Target

Lanthanum Strontium Ferrite (LSF) Sputtering Target

Lanthanum Strontium Gallate Magnesite (LSGM) Sputtering Target

Lanthanum Strontium Manganite (LSM) Sputtering Target

Lead Sputtering Target

Lead Oxide Sputtering Target

Lithium Sputtering Target

Lithium Oxide Sputtering Target

Lutetium Sputtering Target

Lutetium Fluoride Sputtering Target

Lutetium Oxide Sputtering Target

Magnesium Sputtering Target

Magnesium Fluoride Sputtering Target

Magnesium Oxide Sputtering Target

Molybdenum Sputtering Target

Molybdenum Oxide Sputtering Target

Molybdenum Oxide Sputtering Target

Neodymium Sputtering Target

Neodymium Fluoride Sputtering Target

Neodymium-iron-Boron Sputtering Target

Neodymium Oxide Sputtering Target

Nickel-Aluminum Sputtering Target

Nickel-Chrome Sputtering Target

Nickel-Copper Sputtering Target

Nickel Oxide Sputtering Target

Nickel-Platinum Sputtering Target

Nickel-Vanadium Sputtering Target

Nickel Sputtering Target

 

Niobium Sputtering Target

Niobium Oxide Sputtering Target

Osmium Sputtering Target

Osmium Oxide Sputtering Target

Palladium Oxide Sputtering Target

Palladium Sputtering Target

Platinum Oxide Sputtering Target

Platinum Sputtering Target

Potassium Oxide Sputtering Target

Praseodymium Sputtering Target

Praseodymium Fluoride Sputtering Target

Praseodymium Oxide Sputtering Target

Rhenium Sputtering Target

Rhenium Oxide Sputtering Target

Rhodium Sputtering Target

Rhodium Oxide Sputtering Target

Rubidium Oxide Sputtering Target

Ruthenium Oxide Sputtering Target

Ruthenium Sputtering Target

Samarium doped Ceria Sputtering Target

Samarium Sputtering Target

Samarium-Cobalt Sputtering Target

Samarium Fluoride Sputtering Target

Samarium Oxide Sputtering Target

Scandium Fluoride Sputtering Target

Scandium Oxide Sputtering Target

SCZ (Scandium doped Zirconia) Sputtering Target

Scandium Sputtering Target

Selenium Oxide Sputtering Target

Selenium Sputtering Target

Silicon Oxide Sputtering Target

Silicon Sputtering Target

Silver Fluoride Sputtering Target

Silver Oxide Sputtering Target

Sodium Oxide Sputtering Target

Strontium Fluoride Sputtering Target

Strontium Oxide Sputtering Target

 

 

Tantalum Oxide Sputtering Target

Tantalum Sputtering Target

Tellurium Sputtering Target

Tellurium Oxide Sputtering Target

Terbium Fluoride Sputtering Target

Terbium Oxide Sputtering Target

Terbium Sputtering Target
Thallium Oxide Sputtering Target

Thorium Sputtering Target

Thorium Oxide Sputtering Target

Thulium Fluoride Sputtering Target

Thulium Oxide Sputtering Target

Thulium Sputtering Target

Tin Oxide Sputtering Target

Tin Sputtering Target

Titanium Sputtering Target

Titanium-Carbide Sputtering Target

Titanium Oxide Sputtering Target

Titanium-Tungsten Sputtering Target

Tungsten Sputtering Target

Tungsten-Carbide Sputtering Target

Tungsten Oxide Sputtering Target

Uranium Oxide Sputtering Target

Vanadium Sputtering Target

Vanadium Oxide Sputtering Target

YSZ Sputtering Target

Ytterbium Fluoride Sputtering Target

Ytterbium Oxide Sputtering Target

Ytterbium Sputtering Target

Yttrium Aluminum Oxide Sputtering Target

Yttrium Fluoride Sputtering Target

Yttrium doped Ceria Sputtering Target

Yttrium Oxide Sputtering Target

Yttrium Sputtering Target

Zinc Sputtering Target

Zinc Fluoride Sputtering Target

Zinc Oxide Sputtering Target

Zinc-Telluride Sputtering Target

Zirconium Sputtering Target

Zirconium Oxide Sputtering Target

 

PRODUCT CATALOG Price Quote Tolling Ultra High Purity Sputtering Target Crystal Growth Advanced Materials Information Center

 

Recent Research & Development for Sputtering Targets

  • Studies on the oxygenation of human blood by photocatalytic action. Artif Organs. 2007 Nov;31(11):819-25.

  • Chemical energy release and radical formation in cluster-induced sputtering of diatomic molecular targets: a molecular-dynamics model study. Phys Rev Lett. 2007 Jul 13;99(2):027602. Epub 2007 Jul 13.

  • Oxygenation of human blood using photocatalytic reaction. ASAIO J. 2007 Jul-Aug;53(4):434-7.

  • The influence of discharge power and heat treatment on calcium phosphate coatings prepared by RF magnetron sputtering deposition. J Mater Sci Mater Med. 2007 Jun;18(6):1061-9. Epub 2007 Feb 1.

  • Plasma-controlled nanocrystallinity and phase composition of TiO2: a smart way to enhance biomimetic response. J Biomed Mater Res A. 2007 May;81(2):453-64.

  • Direct comparison of Au(3)(+) and C(60)(+) cluster projectiles in SIMS molecular depth profiling. J Am Soc Mass Spectrom. 2007 Mar;18(3):406-12. Epub 2006 Nov 21.

  • Electronic sputtering produced by fission fragments on condensed CO and CO2. J Am Soc Mass Spectrom. 2006 Aug;17(8):1120-8. Epub 2006 Jun 2.

  • Effect of the working gas of the ion-assisted source on the optical and mechanical properties of SiO2 films deposited by dual ion beam sputtering with Si and SiO2 as the starting materials. Appl Opt. 2006 May 20;45(15):3510-5.

  • Nonlinear ripple dynamics on amorphous surfaces patterned by ion beam sputtering. Phys Rev Lett. 2006 Mar 3;96(8):086101. Epub 2006 Feb 27.

  • Multifunctional Ti-(Ca,Zr)-(C,N,O,P) films for load-bearing implants. Biomaterials. 2006 Jul;27(19):3519-31. Epub 2006 Mar 13.

  • Radioactive sputter cathodes for 32P plasma-based ion implantation. Appl Radiat Isot. 2006 May;64(5):556-62. Epub 2006 Jan 6.

  • Experimental apparatus for investigation of sputtering and secondary ion emission induced by energetic ion beams. Rapid Commun Mass Spectrom. 2006;20(2):298-302.

  • Experimental and theoretical evidence for long-lived molecular hydrogen anions H2- and D2-. Phys Rev Lett. 2005 Jun 10;94(22):223003. Epub 2005 Jun 10.

  • Self-organized ordering of nanostructures produced by ion-beam sputtering. Phys Rev Lett. 2005 Jan 14;94(1):016102. Epub 2005 Jan 3.

  • Design, characterization and testing of Ti-based multicomponent coatings for load-bearing medical applications. Biomaterials. 2005 Jun;26(16):2909-24.

  • FePt-Ag nanocomposite thin films with longitudinal magnetic anisotropy. J Nanosci Nanotechnol. 2004 Sep;4(7):704-7.

  • The contribution of collision cascades to sputtering and radiation damage. Philos Transact A Math Phys Eng Sci. 2004 Jan 15;362(1814):5-28.

  • Influence of the composition of BCN films deposited by reactive magnetron sputtering on their properties. Anal Bioanal Chem. 2002 Oct;374(4):709-11. Epub 2002 Sep 5.

  • Design and manufacture of spectrally selective reflecting coatings for the use with laser display projection screens. Appl Opt. 2002 Jun 1;41(16):3097-106.

  • Functionally graded calcium phosphate coatings produced by ion beam sputtering/mixing deposition. Biomaterials. 2001 Jun;22(12):1619-26.

 

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